MP3 NG: A Next Generation Consumer Platform

Table 9: NG Player Semiconductor BOM

R

 

 

 

Part

 

 

Unit

Ext.

Item

Qty.

Mfg.

Number

Description

Volume

Cost

Cost.

 

 

 

 

 

 

 

 

1

4

Samsung

KM29U6400T

Flash, 64Mb

1M/Yr.

$10.00

$40.00

 

 

 

 

 

 

 

 

2

1

Micron

Mt48C1LC1M16A1TG7SIT

SDRAM,

200K/m

$3.50

$3.50

 

 

 

 

512K x 16 x 2 banks

 

 

 

 

 

 

 

 

 

 

 

3

1

IDT

RC32364-133

RISC CPU

100K

$11.50

$11.50

 

 

 

 

 

 

 

 

4

1

Xilinx

XC2S100

FPGA

20K/m

$10.00

$10.00

 

 

 

 

 

 

 

 

5

1

Xilinx

XC1801

Serial Configuration

20K/m

$3.00

$3.00

 

 

 

 

PROM

 

 

 

 

 

 

 

 

 

 

 

6

1

NSC

USB9602

USB Interface Controller

20K/m

$1.63

$1.63

 

 

 

 

 

 

 

 

7

1

SMOS

SED1758T0A

LCD Common Driver,

20K/m

$2.50

$2.50

 

 

 

 

160 Rows

 

 

 

 

 

 

 

 

 

 

 

8

1

SMOS

SED1743T0A

LCD Segment Driver,

20K/m

$2.50

$2.50

 

 

 

 

160 Columns

 

 

 

 

 

 

 

 

 

 

 

9

1

Various

TBD

160 x 160 LCD Panel,

est.

$5.00

$5.00

 

 

 

 

Glass Only

 

 

 

 

 

 

 

 

 

 

 

10

1

MicroTouch

TBD

Touch Screen

est.

$5.00

$5.00

 

 

 

 

 

 

 

 

11

1

Infineon

IRDT6100

1Mb IRDA Transceiver

20K/m

$2.00

$2.00

 

 

 

 

 

 

 

 

12

1

Crystal

CS4343

DAC Stereo Audio

est

$2.00

$2.00

 

 

 

 

 

 

 

 

13

1

Maxim

MAX1108

AD Converter

disti

$2.68

$2.68

 

 

 

 

 

 

 

 

14

1

Maxim

MAX1705

Step-up DC to DC

10K

$2.81

$2.81

 

 

 

 

Converter

 

 

 

 

 

 

 

 

 

 

 

Notes: BOM includes only semiconductor content.

 

 

Total:

$94.12

 

 

 

 

 

 

 

 

References

RC32364 RISController, Hardware User’s Manual, April 1999, Integrated Device Technology Xilinx Spartan-II FPGA Data Sheet, January 2000, Xilinx

IRMS6100 1.15 Mb/s IrDT Data Transceiver Data Sheet, May 1999, Infineon Technologies SED1743 160-bit LCD Common Driver Data Sheet, Epson Electronics

SED1758 160-bit LCD Segment Driver Data Sheet, Epson Electronics

CS4343 Low Voltage, Stereo DAC with Headphone Amp Data Sheet, June 1999, Cirrus Logic MAX1108 2-Channel, Serial 8-bit ADC, Data Sheet, October 1998, Maxim Integrated Products

USBN9602 Full Speed Function Controller With DMA Support Data Sheet, May 1998, National Semiconductor

MT48LC1M16A1 S - 512K x 16 x 2 banks Synchronous DRAM Data Sheet, August 1999, Micron Technologies

KM29U64000T 8M x 8 bit NAND Flash Memory, April 1999, Samsung Semiconductor

26

www.xilinx.com

XAPP169 (v1.0) November 24, 1999

 

1-800-255-7778

 

Page 26
Image 26
Xilinx XAPP169 manual References

XAPP169 specifications

Xilinx XAPP169 is a pioneering application note that delves into the design and implementation of high-performance digital signal processing (DSP) systems. It serves as a reference guide for engineers and designers looking to leverage Xilinx Field Programmable Gate Arrays (FPGAs) for sophisticated DSP applications. The document provides a comprehensive overview of the techniques and methodologies necessary to harness the power and flexibility of FPGA technology in DSP design.

One of the main features of XAPP169 is its focus on the integration of various DSP functions, including filtering, modulation, and Fourier transforms. By utilizing the inherent parallelism of FPGAs, designers can achieve significant performance enhancements compared to traditional DSP implementations. This parallel processing capability allows for real-time processing of high-bandwidth signals, making XAPP169 ideal for applications such as telecommunications, aerospace, and medical imaging.

The application note emphasizes the use of Xilinx’s advanced tools and libraries, such as the Xilinx System Generator for DSP and the Xilinx Vivado Design Suite. These tools facilitate the modeling, simulation, and synthesis of DSP algorithms tailored to specific requirements, enabling a rapid development cycle. By providing pre-optimized building blocks and IP cores, XAPP169 streamlines the design process, reducing time-to-market for new products and innovations.

Additionally, XAPP169 highlights the ability to leverage high-speed serial transceivers present in Xilinx FPGAs. These transceivers enable reliable transmission of data across long distances with minimized latency and optimized bandwidth utilization. The application note outlines various techniques for managing signal integrity and maximizing throughput, ensuring that designs can meet the stringent requirements of modern DSP applications.

Another characteristic of XAPP169 is its attention to resource utilization and optimization strategies. The document discusses how to balance performance with area and power consumption, which is crucial in embedded applications where space and power are at a premium. By employing advanced synthesis strategies and leveraging the capabilities of Xilinx’s architecture, designers can create efficient and scalable DSP systems.

In summary, Xilinx XAPP169 serves as an invaluable resource for engineers seeking to harness the capabilities of FPGAs in DSP applications. With its focus on high-performance design, integration of advanced tools, and optimization strategies, it opens up new possibilities for innovation in various fields where digital signal processing is essential.