Intel S5000XAL manual Processor Population Rules, Common Enabling Kit CEK Design Support

Functional Architecture Intel® Server Board S5000PAL / S5000XAL TPS

Dual-Core Intel® Xeon® processors 5000 sequence will encompass the following:

Table 1. Processor Support Matrix

Processor Family	System Bus	Core	Cache	Watts	Support
	Speed	Frequency
Intel® Xeon® processor	533 MHz	All			No
Intel® Xeon® processor	800 MHz	All			No
			2x 2 MB
Dual-Core Intel® Xeon® processor 5030	667 MHz	2.67 GHz		95	Yes
Dual-Core Intel® Xeon® processor 5050	667 MHz	3.0 GHz	2x 2 MB	95	Yes
Dual-Core Intel® Xeon® processor 5060	1066 MHz	3.2 GHz	2x 2 MB	130	Yes
Dual-Core Intel® Xeon® processor 5063	1066 MHz	3.2 GHz	2x 2 MB	95	Yes
Dual-Core Intel® Xeon® processor 5080	1066 MHz	3.73 GHz	2x 2 MB	130	Yes
Dual-Core Intel® Xeon® processor 5110	1066 MHz	1.60 GHz	4MB shared	65	Yes
Dual-Core Intel® Xeon® processor 5120	1066 MHz	1.87 GHz	4MB shared	65	Yes
Dual-Core Intel® Xeon® processor 5130	1333 MHz	2 GHz	4MB shared	65	Yes
Dual-Core Intel® Xeon® processor 5140	1333 MHz	2.33 GHz	4MB shared	65	Yes
Dual-Core Intel® Xeon® processor 5150	1333 MHz	2.67 GHz	4MB shared	65	Yes
Dual-Core Intel® Xeon® processor 5160	1333 MHz	3 GHz	4MB shared	80	Yes

3.1.2.1Processor Population Rules

When two processors are installed, both must be of identical revision, core voltage, and bus/core speed. Mixed processor steppings is supported. However, the stepping of one processor cannot be greater than one stepping back of the other. When only one processor is installed, it must be in the socket labeled CPU1. The other socket must be empty.

The board is designed to provide up to 130A of current per processor. Processors with higher current requirements are not supported.

No terminator is required in the second processor socket when using a single processor configuration.

3.1.2.2Common Enabling Kit (CEK) Design Support

The server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and heat sink retention solution. The server board ships with a CEK spring snapped onto the underside of the server board, beneath each processor socket. The heat sink attaches to the CEK, over the top of the processor and the thermal interface material (TIM). See the figure below for the stacking order of the chassis, CEK spring, server board, TIM, and heat sink.

The CEK spring is removable, allowing for the use of non-Intel heat sink retention solutions.

Note: The processor heat sink and CEK spring shown in the following diagram are for reference purposes only. The actual processor heat sink and CEK solutions compatible with this generation server board may be of a different design.

26Revision 1.4

Intel order number: D31979-007