Expansion Riser

An expansion slot riser connector of EISA form factor provides the capability to support either two or three PCI slots by changing a motherboard jumper to route any extra IRQ and ID selects. A riser board can also support up to five ISA expansion slots. The PCI bus is compliant with the PCI 2.1 specification.

To ensure that the lowest positioned slot on the riser card can support a full length add-in card the following conditions must be met.

1)The minimum height requirement for the lowest positioned slot on the CPU side of the riser is 1.2”. Therefore the CPU heat sink should be no more than 1.2” high once installed on the processor.

2)The minimum height requirement for the lowest positioned slot on the SIMM side of the riser is 1.3”. Therefore, once SIMM memory is installed they should not be taller than 1.3”.

PERIPHERAL COMPONENT INTERCONNECT (PCI) PCISET

The Intel 82430HX PCIset is made up of two components: The 82439HX controller (TXC) and the 82371SB PCI ISA IDE Xcellerator (PIIX3) ISA bridge. The PCIset provides the following functions:

∙	CPU interface control	(with B0 stepping of the PIIX 3)
∙ Integrated L2 write-back cache controller			– Host/Hub Controller
	– Pipeline Burst SRAM		– Two USB ports
∙	– 256 KB or 512 KB Direct Mapped	∙ Integrated fast IDE interface
∙	Integrated DRAM controller		– Support for up to 4 devices
	– 64/72-bit path to Memory		– PIO Mode 4 transfers up to 16 MB/sec
	– Support for EDO and Fast Page DRAM		– Integrated 8 x 32-bit buffer for Bus
	– 8 MB to 512 MB main memory		Master PCI IDE burst transfers
	– Parity and ECC support	∙	– Bus Master mode
∙ Fully synchronous PCI bus interface		∙	PCI 2.1 Compliant
	– 25/30/33 MHz	∙ Enhanced Fast DMA controller
	– PCI to DRAM > 100 Mbytes/sec	∙ Interrupt controller and steering
∙ Interface between the PCI bus and ISA bus		∙	Counters/Timers
∙ Universal Serial Bus Controller		∙ SMI interrupt logic and timer with Fast On/Off mode

82439HX TXC

The 439HX controller provides all control signals necessary to drive a second level cache and the DRAM array, including multiplexed address signals. It also controls system access to memory and generates snoop controls to maintain cache coherency. The 439HX controller comes in a 324 pin Ball Grid Array package.

82371SB PCI ISA IDE XCELERATOR (PIIX3)

The PIIX3 provides the interface between the PCI and ISA buses and integrates a dual channel fast IDE interface capable of supporting up to 4 devices. USB host/hub bus is provided by the PIIX 3. The PIIX3 integrates seven 32-bit DMA channels, five 16-bit timer/counters, two eight-channel interrupt controllers, PCI-to-AT interrupt mapping circuitry, NMI logic, ISA refresh address generation, and PCI/ISA bus arbitration circuitry onto the same device. The PIIX3 comes in a 208 pin QFP package.

Advanced/RH Technical Product Specification ∙ Page 10

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.