Intel 281809-003 manual Processor Upgrade, Second Level Cache, System Memory, EDO Dram

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PROCESSOR UPGRADE

The Advanced/RH motherboard is manufactured with the 321-pin (socket 7) ZIF processor socket. Socket 7 provides a processor upgrade path that includes higher performance Pentium OverDrive processors than can be supported with socket 5. The motherboard is built to support uniplane CPUs. However, a manufacturing option allows the socket 7 design to support split voltage planes that can supply different voltages for a processor’s CPU core and for the I/O core. Installing a split plane CPU into a motherboard configured only for uniplane processor may cause damage to the CPU.

SECOND LEVEL CACHE

The Intel 82430HX PCIset supports a second level cache that uses high performance Synchronous Pipeline Burst SRAM. Asynchronous cache is not supported by the 82430HX controller. Pipeline Burst (PB) SRAM provides performance similar to expensive Synchronous Burst SRAMs for only a slight cost premium over slower performing asynchronous SRAMs.

As a manufacturing option, the Advanced/RH motherboard without onboard cache can be provided with a Card Edge Low Profile (CELP) version 2.1 socket that provides flexibility for second level cache options. The CELP socket can accommodate either a 256 KB or 512 KB cache module and is designed to work with modules that adhere to the COAST (Cache On A Stick) specification, version 2.1. The cache size is automatically detected and configured by the system BIOS for optimal performance. For a list of cache module suppliers or a copy of the COAST specification, contact your local Intel sales office or Intel authorized distributor.

SYSTEM MEMORY

The Advanced/RH motherboard provides six 72-pin SIMM sites for memory expansion. The sockets support 512 KB x 32 (2MB double sided SIMMs only), 1M x 32 (4 MB), 2M x 32 (8 MB), 4M x 32 (16 MB), 8M x 32 (32 MB), 16M x 32 (64MB), and 32M x 32 (128MB) single-sided or double-sided SIMM modules. Minimum memory size is 8 MB and maximum memory size, using four 32M x 32 SIMM modules, is 512 MB. Memory timing requires 70 ns fast page devices or, for optimum performance 60 ns EDO DRAM. 36-bit SIMM modules may be used for parity or ECC generation and checking.

The six sockets are arranged as Bank 0, Bank 1, and Bank 2. Each bank consists of two sockets and provides a 64/72-bit wide data path. Both SIMMs in a bank must be of the same memory size and type, although each bank may have different types of memory installed. It is even possible to have 70 ns Fast Page DRAM in one bank and 60 ns EDO DRAM in the other, in which case each bank is independently optimized for maximum performance. Any combination of the banks may be populated. There are no jumper settings required for the memory size or type, which is automatically detected by the system BIOS. The Advanced/RH motherboard supports only tin-lead SIMMs.

When banks 1 and 2 are populated at the same time, memory timing is modified from x333 to x444. This is due to loading on the address line shared by these two banks. In most applications the L2 cache will mask any performance degradation that is incurred. In addition, when using EDO Parity memory in an ECC configuration memory timing is changed from x222 to x333 to allow the chipset to perform Read Modify Writes.

EDO DRAM

Extended Data Out, or Hyper Page, DRAM is designed to improve the DRAM read performance. EDO DRAM holds the memory data valid until the next CAS# falling edge, unlike standard fast page mode DRAM which tri-states the memory data when CAS# negates to precharge for the next cycle. With EDO, the CAS# precharge overlaps the data valid time, allowing CAS# to negate earlier while still satisfying the memory data valid window time.

Advanced/RH Technical Product Specification ∙ Page 9

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Contents Advanced/RH Advanced/RH Technical Product Specification ∙ Table of Contents Motherboard Specifications Introduction Audio Subsystem Motherboard Manufacturing OptionsVideo Subsystem Cache SubsystemDD − 256K L2 Pbsram Board Level FeaturesCPU LPX Form FactorSecond Level Cache Processor UpgradeSystem Memory EDO DramExpansion Riser Peripheral Component Interconnect PCI Pciset82371SB PCI ISA IDE Xcelerator PIIX3 National Semiconductor PC87306B Super I/O Controller IDE SupportFloppy Controller Keyboard InterfaceIrda INFRA-RED Support Real Time CLOCK, Cmos RAM and BatteryParallel Port Graphics SubsystemResolution ATI-264VT Resolutions Supported by the MotherboardGraphics Drivers and Utilities Audio SubsystemMotherboard Connectors ConnectorsAudio Drivers Universal Serial BUS USBCdrom MidiPCI IDE Power Supply Control J9H1,J9K2 Front Panel Connections J3A1, J2A1Spkr SLP/PS-ON Hdled Pwrled RST FAN Reset INFRA-RED Irda ConnectorSpeaker Sleep / ResumeAudio Connectors MIDI/AUDIO I/O ConnectorCD-ROM Audio Input Advanced/RH Wave Table Upgrade module Wave Table UpgradeCOM Back Panel ConnectorsPower Consumption System ConfigurationDC Voltage Acceptable tolerance Real Time Clock Battery Replacement Appendix a − User-Installable UpgradesCPU Upgrade Graphics Memory UpgradeHardware Mpeg Module J6C2 Appendix B − Configuration Jumper SettingsFreq Mult SetupCmos RiserCmos -J4L1 a Pins CPU Configuration Jumper Block J4L1C&DPswd -J4L1 a Pins Setup J4L1 B PinsDrive or Overdrive J6C2 Recovery Jumper J6C2Address Range Appendix C − Memory MapSize DescriptionAddress hex Appendix D − I/O MapPiix DMA Bit # DescriptionBus Number Dev Number hex Func. Number Description Appendix E − PCI Configuration Space MapNMI Appendix F − Interrupts & DMA ChannelsSystem Resource Data Width System ResourcePower Supply Appendix G − ConnectorsPrimary Power J9H1 PCI 3.3V Power J9J1 not PopulatedFront PANEL−J3A1 Back Panel I/O IDE Connectors J5C1 & J6C1 Floppy Connector J9K1Peripherals Multimedia PCI / ISA Riser J6J2 Celp 2.1 Connector J1D1 Bios Upgrades Appendix-H Motherboard BiosFlash Memory Implementation System AddressPCI AUTO-CONFIGURATION Setup UtilityAdvanced Power Management ISA Plug ‘N’ PlaySecurity Features Boot OptionsLanguage Support PCI IDESetup Enable Jumper Appendix I − PCI Configuration Error Messages Error Messages Appendix J− Amibios Error messages and Beep CodesBeeps Error Message Beep CodesISA NMI Messages OFF Board Parity Error Addr HEX =Cmos Time and Date Not Set ISA NMI MessageAppendix K − Soft-off Control Motherboard Specifications Parameter Condition SpecificationAppendix L − Environmental Standards Appendix M − Reliability Data

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.
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