Intel 281809-003 Language Support, Pci Ide, Boot Options, Flash Logo Area, Security Features

Page 41

APM is enabled in BIOS by default, however, the system must be configured with an APM driver (such as Power.exe for DOS or vpowerd.386 for Windows 3.x) in order for the system power saving features to take effect. Windows 95 will enable APM automatically upon detecting the presence of the APM BIOS.

LANGUAGE SUPPORT

The BIOS setup screen and help messages are supported in 32 languages. There are 5 languages translated at this time for use; American English, German, Italian, French, and Spanish. Translations of other languages will available at a later date.

With a 1 Mb Flash BIOS, only one language can be resident at a time. The default language is American English, and will always be present unless another language is programmed into the BIOS using the Flash Memory Update Program (FMUP) available on the Intel BBS.

PCI IDE

The two local bus IDE connectors with independent I/O channel support are setup up automatically by the BIOS if the user selects “Autoconfiguration” in setup. The IDE interface supports PIO Mode 3 and Mode 4 hard drives and recognition of ATAPI CD-ROMs, tape drives, and any other ATAPI devices. The BIOS will determine the capabilities of each drive and configure them to optimize capacity and performance. For the high capacity hard drives typically available today, the drive will be automatically configured for Logical Block Addressing (LBA) for maximum capacity and to PIO Mode 3 or 4 depending on the capability of the drive. The user is able to override the auto-configuration options by using the manual mode setting.

BOOT OPTIONS

Booting from CD-ROM is supported in adherence to the “El Torito” bootable CD-ROM format specification developed by Phoenix Technologies and IBM. Under the Boot Options field in setup, CD- ROM is one of four possible boot devices defined in priority order. The default setting is for floppy to be the primary boot device and hard drive to be the secondary boot device and CD-ROM to be the third device. The forth device is set to disabled in the default configuration.. The user can also select network as a boot device. The network option allows booting from a network add-in card with a remote boot ROM installed.

NOTE: A copy of “El Torito” is available on Phoenix Web page.

FLASH LOGO AREA

Advanced/RH supports a 4 KB programmable flash user area located at EC000-ECFFF. An OEM may use this area to display a custom logo. The Advanced/RH BIOS accesses the user area just after completing POST. A utility called USRLUTIL is available on the Intel BBS to assist with installing a logo into flash for display during POST.

SECURITY FEATURES

Administrative Password

If enabled, the administrative password protects all sensitive Setup options from being changed by a user unless the password is entered. Without the proper password the user will be able to configure only the User password and the power management hot key fields. The User password does not alter the protection provided by the Administrative password.

User Password

The User Password feature provides security, preventing the system from booting or entering setup unless the user selected password is entered during the boot process,. The user password can be set using the Setup utility, and must be entered prior to peripheral boot or keyboard/mouse operation.

Advanced/RH Technical Product Specification Page 41

Image 41
Contents Advanced/RH Advanced/RH Technical Product Specification ∙ Table of Contents Motherboard Specifications Introduction Audio Subsystem Motherboard Manufacturing OptionsVideo Subsystem Cache SubsystemDD − 256K L2 Pbsram Board Level FeaturesCPU LPX Form FactorSecond Level Cache Processor UpgradeSystem Memory EDO Dram82371SB PCI ISA IDE Xcelerator PIIX3 Expansion RiserPeripheral Component Interconnect PCI Pciset National Semiconductor PC87306B Super I/O Controller IDE SupportFloppy Controller Keyboard InterfaceIrda INFRA-RED Support Real Time CLOCK, Cmos RAM and BatteryParallel Port Graphics SubsystemResolution ATI-264VT Resolutions Supported by the MotherboardGraphics Drivers and Utilities Audio SubsystemMotherboard Connectors ConnectorsAudio Drivers Universal Serial BUS USBPCI IDE CdromMidi Spkr SLP/PS-ON Hdled Pwrled RST FAN Power Supply Control J9H1,J9K2Front Panel Connections J3A1, J2A1 Reset INFRA-RED Irda ConnectorSpeaker Sleep / ResumeCD-ROM Audio Input Audio ConnectorsMIDI/AUDIO I/O Connector Advanced/RH Wave Table Upgrade module Wave Table UpgradeCOM Back Panel ConnectorsDC Voltage Acceptable tolerance Power ConsumptionSystem Configuration Real Time Clock Battery Replacement Appendix a − User-Installable UpgradesCPU Upgrade Graphics Memory UpgradeHardware Mpeg Module J6C2 Appendix B − Configuration Jumper SettingsFreq Mult SetupCmos RiserCmos -J4L1 a Pins CPU Configuration Jumper Block J4L1C&DPswd -J4L1 a Pins Setup J4L1 B PinsDrive or Overdrive J6C2 Recovery Jumper J6C2Address Range Appendix C − Memory MapSize DescriptionAddress hex Appendix D − I/O MapPiix DMA Bit # DescriptionBus Number Dev Number hex Func. Number Description Appendix E − PCI Configuration Space MapNMI Appendix F − Interrupts & DMA ChannelsSystem Resource Data Width System ResourcePower Supply Appendix G − ConnectorsPrimary Power J9H1 PCI 3.3V Power J9J1 not PopulatedFront PANEL−J3A1 Back Panel I/O Peripherals IDE Connectors J5C1 & J6C1Floppy Connector J9K1 Multimedia PCI / ISA Riser J6J2 Celp 2.1 Connector J1D1 Bios Upgrades Appendix-H Motherboard BiosFlash Memory Implementation System AddressPCI AUTO-CONFIGURATION Setup UtilityAdvanced Power Management ISA Plug ‘N’ PlaySecurity Features Boot OptionsLanguage Support PCI IDESetup Enable Jumper Appendix I − PCI Configuration Error Messages Error Messages Appendix J− Amibios Error messages and Beep CodesBeeps Error Message Beep CodesISA NMI Messages OFF Board Parity Error Addr HEX =Cmos Time and Date Not Set ISA NMI MessageAppendix K − Soft-off Control Appendix L − Environmental Standards Motherboard SpecificationsParameter Condition Specification Appendix M − Reliability Data

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.