Intel 281809-003 ISA NMI Messages, Cmos Time and Date Not Set, OFF Board Parity Error Addr HEX =

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ERROR MESSAGES (CONT.)

CMOS Time and Date Not Set

Diskette Boot Failure

Display Switch Not Proper

DMA Error

DMA #1 Error

DMA #2 Error

FDD Controller Failure

HDD Controller Failure

INTR #1 Error

INTR #2 Error

Invalid Boot Diskette

Keyboard Is Locked...Unlock It

Keyboard Error

KB/Interface Error

Off Board Parity Error

On Board Parity Error

Parity Error ????

Run Standard CMOS Setup to set the date and time in CMOS RAM.

The boot disk in floppy drive A: is corrupt. It cannot be used to boot the system. Use another boot disk and follow the screen instructions.

The display jumper is not implemented on this product, this error will not occur. Error in the DMA controller.

Error in the first DMA channel. Error in the second DMA channel.

The BIOS cannot communicate with the floppy disk drive controller. Check all appropriate connections after the system is powered down.

The BIOS cannot communicate with the hard disk drive controller. Check all appropriate connections after the system is powered down.

Interrupt channel 1 failed POST. Interrupt channel 2 failed POST.

The BIOS can read the disk in floppy drive A:, but cannot boot the system. Use another boot disk. The keyboard lock on the system is engaged. The system must be unlocked to continue.

There is a timing problem with the keyboard. Set the Keyboard option in Standard CMOS Setup to Not Installed to skip the keyboard POST routines.

There is an error in the keyboard connector.

Parity error in memory installed in an expansion slot. The format is:

OFF BOARD PARITY ERROR ADDR (HEX) = (XXXX)

XXXX is the hex address where the error occurred.

Parity is not supported on this product, this error will not occur.

Parity error in system memory at an unknown address.

ISA NMI MESSAGES

ISA NMI Message

Memory Parity Error at xxxxx

I/O Card Parity Error at xxxxx

DMA Bus Time-out

Explanation

Memory failed. If the memory location can be determined, it is displayed as xxxxx. If not, the message is Memory Parity Error ????.

An expansion card failed. If the address can be determined, it is displayed as xxxxx. If not, the message is I/O Card Parity Error ????.

A device has driven the bus signal for more than 7.8 microseconds.

Advanced/RH Technical Product Specification Page 45

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Contents Advanced/RH Advanced/RH Technical Product Specification ∙ Table of Contents Motherboard Specifications Introduction Audio Subsystem Motherboard Manufacturing OptionsVideo Subsystem Cache SubsystemDD − 256K L2 Pbsram Board Level FeaturesCPU LPX Form FactorSecond Level Cache Processor UpgradeSystem Memory EDO DramExpansion Riser Peripheral Component Interconnect PCI Pciset82371SB PCI ISA IDE Xcelerator PIIX3 National Semiconductor PC87306B Super I/O Controller IDE SupportFloppy Controller Keyboard InterfaceIrda INFRA-RED Support Real Time CLOCK, Cmos RAM and BatteryParallel Port Graphics SubsystemResolution ATI-264VT Resolutions Supported by the MotherboardGraphics Drivers and Utilities Audio SubsystemMotherboard Connectors ConnectorsAudio Drivers Universal Serial BUS USBCdrom MidiPCI IDE Power Supply Control J9H1,J9K2 Front Panel Connections J3A1, J2A1Spkr SLP/PS-ON Hdled Pwrled RST FAN Reset INFRA-RED Irda ConnectorSpeaker Sleep / ResumeAudio Connectors MIDI/AUDIO I/O ConnectorCD-ROM Audio Input Advanced/RH Wave Table Upgrade module Wave Table UpgradeCOM Back Panel ConnectorsPower Consumption System ConfigurationDC Voltage Acceptable tolerance Real Time Clock Battery Replacement Appendix a − User-Installable UpgradesCPU Upgrade Graphics Memory UpgradeHardware Mpeg Module J6C2 Appendix B − Configuration Jumper SettingsFreq Mult SetupCmos RiserCmos -J4L1 a Pins CPU Configuration Jumper Block J4L1C&DPswd -J4L1 a Pins Setup J4L1 B PinsDrive or Overdrive J6C2 Recovery Jumper J6C2Address Range Appendix C − Memory MapSize DescriptionAddress hex Appendix D − I/O MapPiix DMA Bit # DescriptionBus Number Dev Number hex Func. Number Description Appendix E − PCI Configuration Space MapNMI Appendix F − Interrupts & DMA ChannelsSystem Resource Data Width System ResourcePower Supply Appendix G − ConnectorsPrimary Power J9H1 PCI 3.3V Power J9J1 not PopulatedFront PANEL−J3A1 Back Panel I/O IDE Connectors J5C1 & J6C1 Floppy Connector J9K1Peripherals Multimedia PCI / ISA Riser J6J2 Celp 2.1 Connector J1D1 Bios Upgrades Appendix-H Motherboard BiosFlash Memory Implementation System AddressPCI AUTO-CONFIGURATION Setup UtilityAdvanced Power Management ISA Plug ‘N’ PlaySecurity Features Boot OptionsLanguage Support PCI IDESetup Enable Jumper Appendix I − PCI Configuration Error Messages Error Messages Appendix J− Amibios Error messages and Beep CodesBeeps Error Message Beep CodesISA NMI Messages OFF Board Parity Error Addr HEX =Cmos Time and Date Not Set ISA NMI MessageAppendix K − Soft-off Control Motherboard Specifications Parameter Condition SpecificationAppendix L − Environmental Standards Appendix M − Reliability Data

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.