Intel 281809-003 manual Appendix M − Reliability Data

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Appendix M Reliability Data

The Mean-Time-Between-Failures (MTBF) data is calculated from predicted data @ 55C.

Advanced/RH motherboard

72706 Hours

Advanced/RH Technical Product Specification

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Contents Advanced/RH Advanced/RH Technical Product Specification ∙ Table of Contents Motherboard Specifications Introduction Motherboard Manufacturing Options Audio SubsystemVideo Subsystem Cache SubsystemBoard Level Features DD − 256K L2 PbsramLPX Form Factor CPUProcessor Upgrade Second Level CacheSystem Memory EDO DramExpansion Riser Peripheral Component Interconnect PCI Pciset82371SB PCI ISA IDE Xcelerator PIIX3 IDE Support National Semiconductor PC87306B Super I/O ControllerFloppy Controller Keyboard InterfaceReal Time CLOCK, Cmos RAM and Battery Irda INFRA-RED SupportParallel Port Graphics SubsystemATI-264VT Resolutions Supported by the Motherboard ResolutionGraphics Drivers and Utilities Audio SubsystemConnectors Motherboard ConnectorsAudio Drivers Universal Serial BUS USBCdrom MidiPCI IDE Power Supply Control J9H1,J9K2 Front Panel Connections J3A1, J2A1Spkr SLP/PS-ON Hdled Pwrled RST FAN INFRA-RED Irda Connector ResetSpeaker Sleep / ResumeAudio Connectors MIDI/AUDIO I/O ConnectorCD-ROM Audio Input Wave Table Upgrade Advanced/RH Wave Table Upgrade moduleBack Panel Connectors COMPower Consumption System ConfigurationDC Voltage Acceptable tolerance Appendix a − User-Installable Upgrades Real Time Clock Battery ReplacementCPU Upgrade Graphics Memory UpgradeHardware Mpeg Module Appendix B − Configuration Jumper Settings J6C2Setup Freq MultCmos RiserCPU Configuration Jumper Block J4L1C&D Cmos -J4L1 a PinsPswd -J4L1 a Pins Setup J4L1 B PinsRecovery Jumper J6C2 Drive or Overdrive J6C2Appendix C − Memory Map Address RangeSize DescriptionAppendix D − I/O Map Address hexPiix DMA Bit # DescriptionAppendix E − PCI Configuration Space Map Bus Number Dev Number hex Func. Number DescriptionAppendix F − Interrupts & DMA Channels NMISystem Resource Data Width System ResourceAppendix G − Connectors Power SupplyPrimary Power J9H1 PCI 3.3V Power J9J1 not PopulatedFront PANEL−J3A1 Back Panel I/O IDE Connectors J5C1 & J6C1 Floppy Connector J9K1Peripherals Multimedia PCI / ISA Riser J6J2 Celp 2.1 Connector J1D1 Appendix-H Motherboard Bios Bios UpgradesFlash Memory Implementation System AddressSetup Utility PCI AUTO-CONFIGURATIONAdvanced Power Management ISA Plug ‘N’ PlayBoot Options Security FeaturesLanguage Support PCI IDESetup Enable Jumper Appendix I − PCI Configuration Error Messages Appendix J− Amibios Error messages and Beep Codes Error MessagesBeeps Error Message Beep CodesOFF Board Parity Error Addr HEX = ISA NMI MessagesCmos Time and Date Not Set ISA NMI MessageAppendix K − Soft-off Control Motherboard Specifications Parameter Condition SpecificationAppendix L − Environmental Standards Appendix M − Reliability Data

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.