Intel 281809-003 manual PCI / ISA Riser J6J2

Page 37

PCI / ISA RISER (J6J2)

Signal Name

IOCHK-

SD7

SD6

SD5

SD4

SD3

SD2

SD1

SD0

IOCHRDY

AEN

SA19

SA18

SA17

SA16

SA15

SA14

SA13

SA12

SA11

SA10

SA9

SA8

SA7

SA6

SA5

SA4

SA3

SA2

SA1

SA0

SBHE-

LA23

LA22

LA21

LA20

LA19

LA18

LA17

MEMR-

MEMW-

SD8

SD9

SD10

SD11

SD12

SD13

SD14

SD15

 

Pin

 

Pin

 

 

 

 

 

 

A1 B1

A2 B2

A3 B3

A4 B4

A5 B5

A6 B6

A7 B7

A8 B8

A9 B9

A10 B10

A11 B11

A12 B12

A13 B13

A14 B14

A15 B15

A16 B16

A17 B17

A18 B18

A19 B19

A20 B20

A21 B21

A22 B22

A23 B23

A24 B24

A25 B25

A26 B26

A27 B27

A28 B28

A29 B29

A30 B30

A31 B31

C1 D1

C2 D2

C3 D3

C4 D4

C5 D5

C6 D6

C7 D7

C8 D8

C9 D9

C10 D10

C11 D11

C12 D12

C13 D13

C14 D14

C15 D15

C16 D16

C17 D17

C18 D18

Signal Name

GND

RSTDRV

Vcc

IRQ9

-5V

DRQ2 -12V 0WS- +12V GND

SMEMW-

SMEMR-

IOW-

IOR-

DACK3-

DRQ3

DACK1-

DRQ1

REFRESH-

SYSCLK

IRQ7

IRQ6

IRQ5

IRQ4

IRQ3

DACK2-

TC

BALE

Vcc

OSC

GND

MEMCS16- IOCS16- IRQ10 IRQ11 IRQ12 IRQ15 IRQ14 DACK0- DRQ0 DACK5- DRQ5 DACK6- DRQ6 DACK7- DRQ7 Vcc

MASTER-

GND

Signal Name

GND

GND

PCIINT0-

PCIINT1-

Vcc

Key

Vcc

PCIRST-

GNT0-

REQ0-

GND

PCLKE

GND

AD30

3.3V Key 3.3V AD28 AD26 AD24 AD22 AD20 AD18 3.3V Key 3.3V AD16

FRAME-

CBE2-

TRDY-

STOP-

SDONE

SBO-

CBE1-

PAR

GND

Key

GND

AD13

AD11

AD9

CBE0-

AD6

AD4

AD2

Key

Vcc

Vcc

GND

GND

 

Pin

 

Pin

 

 

 

 

 

 

E1 F1

E2 F2

E3 F3

E4 F4

E5 F5

E6 F6

E7 F7

E8 F8

E9 F9

E10 F10

E11 F11

E12 F12

E13 F13

E14 F14

E15 F15

E16 F16

E17 F17

E18 F18

E19 F19

E20 F20

E21 F21

E22 F22

E23 F23

E24 F24

E25 F25

E26 F26

E27 F27

E28 F28

E29 F29

E30 F30

E31 F31

G1 H1

G2 H2

G3 H3

G4 H4

G5 H5

G6 H6

G7 H7

G8 H8

G9 H9

G10 H10

G11 H11

G12 H12

G13 H13

G14 H14

G15 H15

G16 H16

G17 H17

G18 H18

G19 H19

Signal Name

GND

GND

PCIINT2-

PCIINT3-

Vcc

Key

Vcc

PCLKF

GND

GNT1-

GND

REQ1-

AD31

AD29

3.3V Key 3.3V AD27 AD25 CBE3- AD23 AD21 AD19 3.3V

Key 3.3V AD17 IRDY-

DEVSEL-

PLOCK-

PERR-

SERR-

AD15

AD14

AD12

GND

Key

GND

AD10

AD8

AD7

AD5

AD3

AD1

AD0

Key

Vcc

Vcc

GND

GND

Advanced/RH Technical Product Specification Page 37

Image 37
Contents Advanced/RH Advanced/RH Technical Product Specification ∙ Table of Contents Motherboard Specifications Introduction Audio Subsystem Motherboard Manufacturing OptionsVideo Subsystem Cache SubsystemDD − 256K L2 Pbsram Board Level FeaturesCPU LPX Form FactorSecond Level Cache Processor UpgradeSystem Memory EDO DramPeripheral Component Interconnect PCI Pciset Expansion Riser82371SB PCI ISA IDE Xcelerator PIIX3 National Semiconductor PC87306B Super I/O Controller IDE SupportFloppy Controller Keyboard InterfaceIrda INFRA-RED Support Real Time CLOCK, Cmos RAM and BatteryParallel Port Graphics SubsystemResolution ATI-264VT Resolutions Supported by the MotherboardGraphics Drivers and Utilities Audio SubsystemMotherboard Connectors ConnectorsAudio Drivers Universal Serial BUS USBMidi CdromPCI IDE Front Panel Connections J3A1, J2A1 Power Supply Control J9H1,J9K2Spkr SLP/PS-ON Hdled Pwrled RST FAN Reset INFRA-RED Irda ConnectorSpeaker Sleep / ResumeMIDI/AUDIO I/O Connector Audio ConnectorsCD-ROM Audio Input Advanced/RH Wave Table Upgrade module Wave Table UpgradeCOM Back Panel ConnectorsSystem Configuration Power ConsumptionDC Voltage Acceptable tolerance Real Time Clock Battery Replacement Appendix a − User-Installable UpgradesCPU Upgrade Graphics Memory UpgradeHardware Mpeg Module J6C2 Appendix B − Configuration Jumper SettingsFreq Mult SetupCmos RiserCmos -J4L1 a Pins CPU Configuration Jumper Block J4L1C&DPswd -J4L1 a Pins Setup J4L1 B PinsDrive or Overdrive J6C2 Recovery Jumper J6C2Address Range Appendix C − Memory MapSize DescriptionAddress hex Appendix D − I/O MapPiix DMA Bit # DescriptionBus Number Dev Number hex Func. Number Description Appendix E − PCI Configuration Space MapNMI Appendix F − Interrupts & DMA ChannelsSystem Resource Data Width System ResourcePower Supply Appendix G − ConnectorsPrimary Power J9H1 PCI 3.3V Power J9J1 not PopulatedFront PANEL−J3A1 Back Panel I/O Floppy Connector J9K1 IDE Connectors J5C1 & J6C1Peripherals Multimedia PCI / ISA Riser J6J2 Celp 2.1 Connector J1D1 Bios Upgrades Appendix-H Motherboard BiosFlash Memory Implementation System AddressPCI AUTO-CONFIGURATION Setup UtilityAdvanced Power Management ISA Plug ‘N’ PlaySecurity Features Boot OptionsLanguage Support PCI IDESetup Enable Jumper Appendix I − PCI Configuration Error Messages Error Messages Appendix J− Amibios Error messages and Beep CodesBeeps Error Message Beep CodesISA NMI Messages OFF Board Parity Error Addr HEX =Cmos Time and Date Not Set ISA NMI MessageAppendix K − Soft-off Control Parameter Condition Specification Motherboard SpecificationsAppendix L − Environmental Standards Appendix M − Reliability Data

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.