Intel 281809-003 manual Appendix I − PCI Configuration Error Messages

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Appendix I − PCI Configuration Error Messages

The following PCI messages are displayed as a group with bus, device and function information. <'NVRAM Checksum Error, NVRAM Cleared'>, \ ; String

<'System Board Device Resource Conflict'>, \ ; String <'Primary Output Device Not Found'>, \ ; String <'Primary Input Device Not Found'>, \ ; String <'Primary Boot Device Not Found'>, \ ; String <'NVRAM Cleared By Jumper'>, \ ; String <'NVRAM Data Invalid, NVRAM Cleared'>, \ ; String <'Static Device Resource Conflict'>, \ ; String

The following messages chain together to give a message such as: "PCI I/O Port Conflict: Bus: 00, Device 0D, Function: 01".

If and when more than 15 PCI conflict errors are detected the log full message is displayed.

<'PCI I/O Port Conflict:'>, \ ; String <'PCI Memory Conflict: '>, \ ; String

<'PCI IRQ Conflict: '>, \ ; String

<' Bus '>, \

; String

<', Device '>, \

; String

<', Function '>, \ ; String

<‘,PCI Error Log is Full.'>, \ ; String

<'Floppy Disk Controller Resource Conflict '>, \ ; Text <'Primary IDE Controller Resource Conflict '>, \ ; Text <'Secondary IDE Controller Resource Conflict '>, \ ; Text <'Parallel Port Resource Conflict '>, \ ; Text

<'Serial Port 1 Resource Conflict '>, \ ; Text <'Serial Port 2 Resource Conflict '>, \ ; Text

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Contents Advanced/RH Advanced/RH Technical Product Specification ∙ Table of Contents Motherboard Specifications Introduction Cache Subsystem Motherboard Manufacturing OptionsAudio Subsystem Video SubsystemDD − 256K L2 Pbsram Board Level FeaturesCPU LPX Form FactorEDO Dram Processor UpgradeSecond Level Cache System MemoryPeripheral Component Interconnect PCI Pciset Expansion Riser82371SB PCI ISA IDE Xcelerator PIIX3 Keyboard Interface IDE SupportNational Semiconductor PC87306B Super I/O Controller Floppy ControllerGraphics Subsystem Real Time CLOCK, Cmos RAM and BatteryIrda INFRA-RED Support Parallel PortAudio Subsystem ATI-264VT Resolutions Supported by the MotherboardResolution Graphics Drivers and UtilitiesUniversal Serial BUS USB ConnectorsMotherboard Connectors Audio DriversMidi CdromPCI IDE Front Panel Connections J3A1, J2A1 Power Supply Control J9H1,J9K2Spkr SLP/PS-ON Hdled Pwrled RST FAN Sleep / Resume INFRA-RED Irda ConnectorReset SpeakerMIDI/AUDIO I/O Connector Audio ConnectorsCD-ROM Audio Input Advanced/RH Wave Table Upgrade module Wave Table UpgradeCOM Back Panel ConnectorsSystem Configuration Power ConsumptionDC Voltage Acceptable tolerance Graphics Memory Upgrade Appendix a − User-Installable UpgradesReal Time Clock Battery Replacement CPU UpgradeHardware Mpeg Module J6C2 Appendix B − Configuration Jumper SettingsRiser SetupFreq Mult CmosSetup J4L1 B Pins CPU Configuration Jumper Block J4L1C&DCmos -J4L1 a Pins Pswd -J4L1 a PinsDrive or Overdrive J6C2 Recovery Jumper J6C2Description Appendix C − Memory MapAddress Range SizeBit # Description Appendix D − I/O MapAddress hex Piix DMABus Number Dev Number hex Func. Number Description Appendix E − PCI Configuration Space MapData Width System Resource Appendix F − Interrupts & DMA ChannelsNMI System ResourcePCI 3.3V Power J9J1 not Populated Appendix G − ConnectorsPower Supply Primary Power J9H1Front PANEL−J3A1 Back Panel I/O Floppy Connector J9K1 IDE Connectors J5C1 & J6C1Peripherals Multimedia PCI / ISA Riser J6J2 Celp 2.1 Connector J1D1 System Address Appendix-H Motherboard BiosBios Upgrades Flash Memory ImplementationISA Plug ‘N’ Play Setup UtilityPCI AUTO-CONFIGURATION Advanced Power ManagementPCI IDE Boot OptionsSecurity Features Language SupportSetup Enable Jumper Appendix I − PCI Configuration Error Messages Beep Codes Appendix J− Amibios Error messages and Beep CodesError Messages Beeps Error MessageISA NMI Message OFF Board Parity Error Addr HEX =ISA NMI Messages Cmos Time and Date Not SetAppendix K − Soft-off Control Parameter Condition Specification Motherboard SpecificationsAppendix L − Environmental Standards Appendix M − Reliability Data

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.
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