Intel 281809-003 manual Introduction

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Introduction

The Advanced/RH motherboard integrates the latest advances in processor, memory, and I/O technologies into a standard LPX form factor that provides leading edge technology. This combination of high integration and high performance makes the Advanced/RH motherboard the ideal platform for the increasing requirements of today's (and tomorrow's) desktop applications in the corporate workspace.

The flexible LPX design will accept Pentium® processors operating at 75 MHz, 90 MHz, 100 MHz, 120 MHz, 133 MHz, 150 MHz and 166 MHz as well as future Pentium processors. The processor subsystem is complemented by a Revision 2.1 Card Edge Low Profile (CELP 2.1) socket that accepts either a 256 KB or 512 KB second level write- back cache module using pipelined synchronous burst technology. There is also an option for having 256 KB of Pipeline Burst SRAM soldered onto the motherboard. If cache memory is soldered on the motherboard, the CELP socket will not be installed. Only one type of cache may be used on the Advanced/RH motherboard. The memory subsystem is designed to support up to 512 MB of EDO DRAM (for improved performance) or standard Fast Page DRAM in standard 72-pin SIMM† sockets. A Type 7 Pentium OverDrive® socket provides an upgrade to future OverDrive processors.

The Advanced/RH motherboard utilizes Intel's 82430HX PCIset to provide increased integration and performance over other motherboard designs. The Intel 82430HX PCIset contains an integrated PCI Bus Mastering IDE controller with two high performance IDE interfaces for up to four IDE devices (such as hard drives, CD-ROM readers, and so forth). The 82430HX PCIset coupled with the integration of the industry’s latest peripherals gives the user a robust computing platform.

Complementing the 82439HX PCI controller is the 82371SB PIIX3 ISA bridge, offering new technology like USB expandability. The PIIX3 performs as a host on the Universal Serial Bus, and in the middle of 1996 Advanced/RH will provide connectors to accommodate USB peripherals.

ATI† 264-VT video, with fast SGRAM video memory, provides excellent performance advantages over alternate solutions using EDO memory. ATI Media Connector modules, supplied by ATI Technologies, can be used to accelerate hardware MPEG and provide the tuner capabilities that previously required an entire add in card. Memory expansion modules, also supplied by ATI, can upgrade the motherboard from 1MB to 2 or 4 MB of SGRAM.

The National PC87306B Super I/O controller integrates the standard PC I/O functions: floppy interface, two FIFO serial ports, one EPP/ECP capable parallel port, a Real Time Clock, keyboard controller, and support for an IrDA† compatible infrared interface.

To provide for the increasing number of multimedia applications, a Creative† VIBRA16S audio CODEC is integrated onto the motherboard. Either consumer audio or business audio is selected by the OEM. Consumer audio will not have onboard jacks, like business audio, but will provide audio connections via an audio riser card. Either audio solution is provided by the VIBRA16S audio controller, and it provides 16-bit stereo, Sound Blaster Pro† compatible audio with full duplex capabilities to meet the demands of interactive multimedia applications. PCI and ISA expansion slots are supported by a connector on the motherboard designed to accept a riser card.

In addition to superior hardware capabilities, a full set of software drivers and utilities are available to allow advanced operating systems such as Microsoft† Windows† 95 to take full advantage of the hardware capabilities. Features such as bus mastering IDE, Windows 95-ready Plug ‘N’ Play, Advanced Power Management (APM) with application restart, software-controlled power supply shutdown, and full duplex audio are all provided by software available for the Advanced/RH.

Advanced/RH Technical Product Specification ∙ Page 5

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Contents Advanced/RH Advanced/RH Technical Product Specification ∙ Table of Contents Motherboard Specifications Introduction Audio Subsystem Motherboard Manufacturing OptionsVideo Subsystem Cache SubsystemDD − 256K L2 Pbsram Board Level FeaturesCPU LPX Form FactorSecond Level Cache Processor UpgradeSystem Memory EDO Dram82371SB PCI ISA IDE Xcelerator PIIX3 Expansion RiserPeripheral Component Interconnect PCI Pciset National Semiconductor PC87306B Super I/O Controller IDE SupportFloppy Controller Keyboard InterfaceIrda INFRA-RED Support Real Time CLOCK, Cmos RAM and BatteryParallel Port Graphics SubsystemResolution ATI-264VT Resolutions Supported by the MotherboardGraphics Drivers and Utilities Audio SubsystemMotherboard Connectors ConnectorsAudio Drivers Universal Serial BUS USBPCI IDE CdromMidi Spkr SLP/PS-ON Hdled Pwrled RST FAN Power Supply Control J9H1,J9K2Front Panel Connections J3A1, J2A1 Reset INFRA-RED Irda ConnectorSpeaker Sleep / ResumeCD-ROM Audio Input Audio ConnectorsMIDI/AUDIO I/O Connector Advanced/RH Wave Table Upgrade module Wave Table UpgradeCOM Back Panel ConnectorsDC Voltage Acceptable tolerance Power ConsumptionSystem Configuration Real Time Clock Battery Replacement Appendix a − User-Installable UpgradesCPU Upgrade Graphics Memory UpgradeHardware Mpeg Module J6C2 Appendix B − Configuration Jumper SettingsFreq Mult SetupCmos RiserCmos -J4L1 a Pins CPU Configuration Jumper Block J4L1C&DPswd -J4L1 a Pins Setup J4L1 B PinsDrive or Overdrive J6C2 Recovery Jumper J6C2Address Range Appendix C − Memory MapSize DescriptionAddress hex Appendix D − I/O MapPiix DMA Bit # DescriptionBus Number Dev Number hex Func. Number Description Appendix E − PCI Configuration Space MapNMI Appendix F − Interrupts & DMA ChannelsSystem Resource Data Width System ResourcePower Supply Appendix G − ConnectorsPrimary Power J9H1 PCI 3.3V Power J9J1 not PopulatedFront PANEL−J3A1 Back Panel I/O Peripherals IDE Connectors J5C1 & J6C1Floppy Connector J9K1 Multimedia PCI / ISA Riser J6J2 Celp 2.1 Connector J1D1 Bios Upgrades Appendix-H Motherboard BiosFlash Memory Implementation System AddressPCI AUTO-CONFIGURATION Setup UtilityAdvanced Power Management ISA Plug ‘N’ PlaySecurity Features Boot OptionsLanguage Support PCI IDESetup Enable Jumper Appendix I − PCI Configuration Error Messages Error Messages Appendix J− Amibios Error messages and Beep CodesBeeps Error Message Beep CodesISA NMI Messages OFF Board Parity Error Addr HEX =Cmos Time and Date Not Set ISA NMI MessageAppendix K − Soft-off Control Appendix L − Environmental Standards Motherboard SpecificationsParameter Condition Specification Appendix M − Reliability Data

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.
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