Intel 281809-003 manual Speaker, Sleep / Resume, INFRA-RED Irda Connector, Reset

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SPEAKER

The external speaker provides error beep code information during the Power-On Self Test if the system cannot use the video interface. If no speakers are plugged into the audio output jack, the audio output is redirected to the external PC speaker.

SLEEP / RESUME

When Advanced Power Management (APM) is activated in the system BIOS and the operating system’s APM driver is loaded, Sleep mode (Stand-By) can be entered in one of three ways: an optional front panel “Sleep/Resume” button, a user defined keyboard hot key, or prolonged system inactivity. The Sleep/Resume button is supported by a 2-pin header located on the front panel I/O connector. Closing the “Sleep” switch will generate an SMI (System Management Interrupt) to the processor which immediately goes into System Management Mode (SMM), the so called “Sleep” mode. The front panel “Sleep mode” switch must be a momentary two pin SPST type that is normally open. The function of the Sleep/Resume button can also be achieved via a keyboard hot-key sequence, or by a time-out of the system inactivity timer. Both the keyboard hot-key and the inactivity timer are programmable in the BIOS setup (timer is set to 10 minutes by default). To re-activate the system, or “Resume”, the user must simply press the sleep/resume button again, or use the keyboard or mouse. Note that mouse activity will only “wake up” the system if a mouse driver is loaded. While the system is in Stand-By or “sleep” mode it is fully capable of responding to and servicing external interrupts (such as incoming fax) even though the monitor will only turn on if a user interrupt (keyboard/mouse) occurs as mentioned above. This interface is also supported by pins 1 and 2 of the PS SLEEP connector.

INFRA-RED (IRDA) CONNECTOR

Serial port 2 can be configured to support an IrDA module via a 5 pin header connector . Once configured for IrDA, the user can transfer files to or from portable devices such as laptop computers, PDA’s or printers using application software such as Traveling Software’s LapLink. The IrDA specification provides for data transfers at 115 Kbps from a distance of 1 meter.

RESET

This 2-pin header can be connected to a momentary SPST type switch that is normally open. When the switch is closed, the system will hard reset and run POST.

Advanced/RH Technical Product Specification ∙ Page 17

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Contents Advanced/RH Advanced/RH Technical Product Specification ∙ Table of Contents Motherboard Specifications Introduction Audio Subsystem Motherboard Manufacturing OptionsVideo Subsystem Cache SubsystemDD − 256K L2 Pbsram Board Level FeaturesCPU LPX Form FactorSecond Level Cache Processor UpgradeSystem Memory EDO Dram82371SB PCI ISA IDE Xcelerator PIIX3 Expansion RiserPeripheral Component Interconnect PCI Pciset National Semiconductor PC87306B Super I/O Controller IDE SupportFloppy Controller Keyboard InterfaceIrda INFRA-RED Support Real Time CLOCK, Cmos RAM and BatteryParallel Port Graphics SubsystemResolution ATI-264VT Resolutions Supported by the MotherboardGraphics Drivers and Utilities Audio SubsystemMotherboard Connectors ConnectorsAudio Drivers Universal Serial BUS USBPCI IDE CdromMidi Spkr SLP/PS-ON Hdled Pwrled RST FAN Power Supply Control J9H1,J9K2Front Panel Connections J3A1, J2A1 Reset INFRA-RED Irda ConnectorSpeaker Sleep / ResumeCD-ROM Audio Input Audio ConnectorsMIDI/AUDIO I/O Connector Advanced/RH Wave Table Upgrade module Wave Table UpgradeCOM Back Panel ConnectorsDC Voltage Acceptable tolerance Power ConsumptionSystem Configuration Real Time Clock Battery Replacement Appendix a − User-Installable UpgradesCPU Upgrade Graphics Memory UpgradeHardware Mpeg Module J6C2 Appendix B − Configuration Jumper SettingsFreq Mult SetupCmos RiserCmos -J4L1 a Pins CPU Configuration Jumper Block J4L1C&DPswd -J4L1 a Pins Setup J4L1 B PinsDrive or Overdrive J6C2 Recovery Jumper J6C2Address Range Appendix C − Memory MapSize DescriptionAddress hex Appendix D − I/O MapPiix DMA Bit # DescriptionBus Number Dev Number hex Func. Number Description Appendix E − PCI Configuration Space MapNMI Appendix F − Interrupts & DMA ChannelsSystem Resource Data Width System ResourcePower Supply Appendix G − ConnectorsPrimary Power J9H1 PCI 3.3V Power J9J1 not PopulatedFront PANEL−J3A1 Back Panel I/O Peripherals IDE Connectors J5C1 & J6C1Floppy Connector J9K1 Multimedia PCI / ISA Riser J6J2 Celp 2.1 Connector J1D1 Bios Upgrades Appendix-H Motherboard BiosFlash Memory Implementation System AddressPCI AUTO-CONFIGURATION Setup UtilityAdvanced Power Management ISA Plug ‘N’ PlaySecurity Features Boot OptionsLanguage Support PCI IDESetup Enable Jumper Appendix I − PCI Configuration Error Messages Error Messages Appendix J− Amibios Error messages and Beep CodesBeeps Error Message Beep CodesISA NMI Messages OFF Board Parity Error Addr HEX =Cmos Time and Date Not Set ISA NMI MessageAppendix K − Soft-off Control Appendix L − Environmental Standards Motherboard SpecificationsParameter Condition Specification Appendix M − Reliability Data

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.
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