Enterasys Networks XSR-3150 manual System Specifications

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Specifications

System Specifications

This appendix details XSR data about hardware functionality including:

•Processor, system memory, chassis, power supply, interfaces

•Required cabling, CompactFlash and other accessories

•Pinout assignments for WAN and LAN interfaces

•LED behavior

Refer to tables throughout this appendix for specific information.

Table A-1 XSR Hardware Specifications

Category		Parameters
Processor	Type	Broadcom 1250 with two CPU cores
	Dual-core	1700 Dhrystone MIPS @ 600 MHz
	Operating Speed
Hardware	VPN	Encryption Module chip (310 Mbps) for 3DES encryption, message
accelerator		digest (MD-5, SHA-1), and public key acceleration,
System	RAM	2, Micron 184-pin, SDRAM DIMM, 128 Mbyte memory modules at
Memory		133 MHz each (data rate of 256 Mbps)
	Non-Volatile	8 Mbytes of Onboard Flash - no upgrade
		Up to 1 Gbyte optional plug-in CompactFlash card. Type I and II CF
		cards supported
Chassis	Form Factor	19-inch rack-mountable
	Dimensions	1U (1-11/16 inches high by 17 inches wide by 21 inches deep)
	Weight	20 pounds
Heat	Forced air cooling	Maximum heat release of a fully configured system is
Dissipation		443.3 BTU/hr
Environment	Operating temp.	0 - 40° C
	Storage temp.	-40 - 70° C
	Relative Humidity	5% - 90%, non-condensing

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