
CY8C23433, CY8C23533
Packaging Information
This section illustrates the packaging specifications for the CY8C23x33 PSoC device, along with the thermal impedances for each package, solder reflow peak temperature, and the typical package capacitance on crystal pins.
Figure 19. 32-Pin (5x5 mm) QFN
SEE NOTE 1
TOP VIEW
BOTTOM VIEW
SIDE VIEW
NOTES:
1. HATCH AREA IS SOLDERABLE EXPOSED PAD
2.BASED ON REF JEDEC #
3.PACKAGE WEIGHT: 0.0388g
4.DIMENSIONS ARE IN MILLIMETERS
Document Number: | Page 34 of 37 |
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