Cypress CY8C23433 Thermal Impedances, Capacitance on Crystal Pins, Solder Reflow Peak Temperature

CY8C23433, CY8C23533

Figure 20. 28-Pin (210-Mil) SSOP

51-85079 *C

Thermal Impedances

Table 38. Thermal Impedances by Package

Package	Typical θJA[22]
32 QFN	19.4°C/W
28 SSOP	95°C/W

Capacitance on Crystal Pins

Table 39. Typical Package Capacitance on Crystal Pins

Package	Package Capacitance
32 QFN	2.0 pF
28 SSOP	2.8 pF

Solder Reflow Peak Temperature

Following is the minimum solder reflow peak temperature to achieve good solderability.

Table 40. Solder Reflow Peak Temperature
Package	Minimum Peak Temperature [23]	Maximum Peak Temperature
32 QFN	240°C	260°C
28 SSOP	240°C	260°C

Notes

22.TJ = TA + POWER x θJA.

23.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC Refer to the solder manufacturer specifications.

with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu paste.

Document Number: 001-44369 Rev. *B Page 35 of 37

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