Cypress CY62148E manual Thermal Resistance, AC Test Loads and Waveforms, Data Retention Waveform

CY62148E MoBL®

Thermal Resistance [10]

Parameter	Description	Test Conditions	SOIC	TSOP II	Unit
			Package	Package
ΘJA	Thermal Resistance	Still Air, soldered on a 3 × 4.5 inch,	75	77	°C/W
	(Junction to Ambient)	two-layer printed circuit board
ΘJC	Thermal Resistance		10	13	°C/W
	(Junction to Case)

AC Test Loads and Waveforms

R1

VCC

ALL INPUT PULSES

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

		3.0V			90%
R2	10%
		GND
	Rise Time = 1 V/ns
Equivalent to:	THEVENIN EQUIVALENT
OUTPUT			RTH	V

90%

10%

Fall Time = 1 V/ns

Parameters	5.0V	Unit
R1	1800	Ω
R2	990	Ω
RTH	639	Ω
VTH	1.77	V

Data Retention Characteristics (Over the Operating Range)

	Parameter	Description			Conditions		Min	Typ [3]	Max	Unit
VDR		VCC for Data Retention					2			V
ICCDR		Data Retention Current	VCC= VDR,		> VCC – 0.2V,	Ind’l/Auto-A		1	7	∝A
				CE
			VIN > VCC – 0.2V or VIN < 0.2V
tCDR [10]		Chip Deselect to Data Retention Time					0			ns
t	[11]	Operation Recovery Time					t			ns
	R						RC

Data Retention Waveform

		VCC(min)	DATA RETENTION MODE		VCC(min)
V	CC		V	> 2.0V
		tCDR	DR		tR
CE

Note

11. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 ∝s or stable at VCC(min) > 100 ∝s.
Document #: 38-05442 Rev. *F	Page 4 of 10

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