HP Modular Cooling System manual HP 10642 G2 Rack specifications, Thermal and air flow performance

Page 62

Thermal and air flow performance

Maximum thermal and air flow performance

Specifications

parameters

 

 

 

Air temperature—inlet to rack-mounted components

25ºC (68ºF)

 

 

Chilled water temperature

7º–10°C (45º–50°F)

 

 

Total rack-mounted component air flow

2,600 cfm or less at 0 or more pressure drop

 

across the rack-mounted components

 

 

Chilled water flow rate

21 gal/min

 

 

Chilled water pressure differential at flow needed to

2.0 bar delta pressure

meet thermal specifications

 

 

 

Heat lost to room

approximately 10% maximum depending on

 

the MCS settings and room temperature

 

 

Heat transferred to cooling fluid

35 kW maximum

 

 

Environmental specifications

Features

Specifications

 

 

Operating temperature

5ºC to 52ºC (41ºF to 95ºF)

 

 

Non-operating temperature

0ºC to 60ºC (32ºF to 140ºF)

 

 

Transit temperature

-30ºC to 60ºC (-22ºF to 140ºF), up to 72 hours

 

 

Storage temperature

-20ºC to 60ºC (-4ºF to 140ºF)

 

 

Operating humidity

20 to 80% relative humidity (non-condensing)

 

 

Non-operating humidity

5 to 95% relative humidity (non-condensing)

 

 

Operating altitude

-76.2 to 3,048 m (-250 to 10,000 ft)

 

 

Non-operating altitude

-76.2 to 9,144 m (-250 to 30,000 ft)

 

 

HP 10642 G2 Rack specifications

U height

Width

Depth

Dynamic load (gross)

Static load

 

 

 

 

 

42U

600 mm

1,000 mm

907.18 kg (2,000 lb)

907.18 kg (2,000

 

(23.82 in)

(39.37 in)

 

lb)

 

 

 

 

 

Specifications 62

Image 62
Contents HP Modular Cooling System User Guide Part Number February 2007 Second EditionAudience assumptions Contents Replaceable parts and maintenance and service information Overview IntroductionReference Site preparation Configuration factorsOptimum environment and site requirements Installation MCS kit contentsRack hardware kit contents Required toolsInstalling the MCS unit Installation Installation Installation Installation Installation Powering up and configuring the unit Installation Installation Installation Installation Installation Return to the Main Menu Network Configuration screen Enter 4 Activate Actual ValuesInstallation Installation Configuring the IP address through the web interface Installation Installation Installation Installation Management module Management module overviewManagement module components Logging in through the terminal emulation program Reference DescriptionAccessing the management module through the web interface Web interface requirementsLogging in through the web interface Software BrowserConnecting an external alarm relay To add an external alarm relayManagement module Serial interface HP Modular Cooling System Utility overviewMain menu Option number Submenu DescriptionMenu Network Configuration submenu IP Configuration submenu Change Passwords submenu Info Configuring HyperTerminal Factory Default submenuConfiguring Minicom Operator display components Operator displayOperator display overview Indicators Meaning Sensors Sensors Water group sensor Snmp notification Type of message Solution Solution Uneven heat load Indicators Meaning Page Indicators Meaning Has been exceeded or the water flow is less than 2 l/min Indicators Meaning Adjusting the operator display Operator display Automatic Door Release Kit Automatic Door Release Kit OverviewQuestion Answer Frequently asked questionsHP Modular Cooling System frequently asked questions Port x set out lf=strip Issue Resolution TroubleshootingHP Modular Cooling System troubleshooting Specification SpecificationsMCS specifications Features Specifications HP 10642 G2 Rack specificationsEnvironmental specifications Thermal and air flow performanceAir and water heat exchanger maintenance Replaceable parts and maintenance and service informationMaintenance and service Replaceable partsAcceptable water quality range Water quality requirements and specificationsCooling water composition guidelines Hydrological data Acceptable range CSBLeveling requirements Monitoring the quality of cooling solutionsAdjust the MCS leveling feet so that the unit is level Frost damageCondensation management HP contact information Technical supportBefore you contact HP Customer Self RepairRéparation par le client CSR Riparazione da parte del cliente Reparaciones del propio cliente Reparo feito pelo cliente Technical support Technical support Technical support Federal Communications Commission notice Regulatory compliance noticesRegulatory compliance identification numbers ModificationsEuropean Union regulatory notice CablesCanadian notice Regulatory compliance notices Battery replacement notice Taiwan battery recycling noticePower cord statement for Japan Acronyms and abbreviations Simple Mail Transfer Protocol Power distribution unitSystems Insight Manager Simple Network Management ProtocolIndex Index
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.