HP Modular Cooling System Regulatory compliance notices, Federal Communications Commission notice

Page 76

Regulatory compliance notices

In this section

 

Regulatory compliance identification numbers

76

Federal Communications Commission notice

76

Modifications

76

Cables

77

Canadian notice

77

European Union regulatory notice

77

Disposal of waste equipment by users in private households in the European Union

78

Japanese class A notice

78

BSMI notice

78

Korean class A notice

78

Laser compliance

78

Battery replacement notice

79

Taiwan battery recycling notice

79

Power cord statement for Japan

80

Regulatory compliance identification numbers

For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number. The regulatory model number is not the marketing name or model number of the product.

Federal Communications Commission notice

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at personal expense.

Modifications

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Hewlett-Packard Company may void the user’s authority to operate the equipment.

Regulatory compliance notices 76

Image 76
Contents HP Modular Cooling System User Guide Part Number February 2007 Second EditionAudience assumptions Contents Replaceable parts and maintenance and service information Overview IntroductionReference Optimum environment and site requirements Configuration factorsSite preparation Installation MCS kit contentsRack hardware kit contents Required toolsInstalling the MCS unit Installation Installation Installation Installation Installation Powering up and configuring the unit Installation Installation Installation Installation Installation Return to the Main Menu Network Configuration screen Enter 4 Activate Actual ValuesInstallation Installation Configuring the IP address through the web interface Installation Installation Installation Installation Management module Management module overviewManagement module components Logging in through the terminal emulation program Reference DescriptionAccessing the management module through the web interface Web interface requirementsLogging in through the web interface Software BrowserConnecting an external alarm relay To add an external alarm relayManagement module Serial interface HP Modular Cooling System Utility overviewMain menu Option number Submenu DescriptionMenu Network Configuration submenu IP Configuration submenu Change Passwords submenu Info Configuring HyperTerminal Factory Default submenuConfiguring Minicom Operator display overview Operator displayOperator display components Indicators Meaning Sensors Sensors Water group sensor Snmp notification Type of message Solution Solution Uneven heat load Indicators Meaning Page Indicators Meaning Has been exceeded or the water flow is less than 2 l/min Indicators Meaning Adjusting the operator display Operator display Automatic Door Release Kit Automatic Door Release Kit OverviewHP Modular Cooling System frequently asked questions Frequently asked questionsQuestion Answer Port x set out lf=strip HP Modular Cooling System troubleshooting TroubleshootingIssue Resolution MCS specifications SpecificationsSpecification HP 10642 G2 Rack specifications Environmental specificationsFeatures Specifications Thermal and air flow performanceReplaceable parts and maintenance and service information Maintenance and serviceAir and water heat exchanger maintenance Replaceable partsCooling water composition guidelines Water quality requirements and specificationsAcceptable water quality range Hydrological data Acceptable range CSBMonitoring the quality of cooling solutions Adjust the MCS leveling feet so that the unit is levelLeveling requirements Frost damageCondensation management Technical support Before you contact HPHP contact information Customer Self RepairRéparation par le client CSR Riparazione da parte del cliente Reparaciones del propio cliente Reparo feito pelo cliente Technical support Technical support Technical support Regulatory compliance notices Regulatory compliance identification numbersFederal Communications Commission notice ModificationsCanadian notice CablesEuropean Union regulatory notice Regulatory compliance notices Battery replacement notice Taiwan battery recycling noticePower cord statement for Japan Acronyms and abbreviations Power distribution unit Systems Insight ManagerSimple Mail Transfer Protocol Simple Network Management ProtocolIndex Index
Related manuals
Manual 10 pages 27.17 Kb Manual 93 pages 20.21 Kb Manual 4 pages 15.71 Kb Manual 16 pages 5.24 Kb Manual 83 pages 40.42 Kb Manual 60 pages 37.09 Kb

Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.