HP Modular Cooling System manual Hydrological data Acceptable range, Csb

Page 65

Hydrological data

Acceptable range

 

 

Free carbonic acid

8–15 mg/dm3

Accompanying carbonic acid

8–15 mg/dm3

Corrosive carbonic acid

0 mg/dm3

Sulphides

Free

 

 

Oxygen

< 10 mg/dm3

Chloride ions

< 50 mg/dm3

Sulphate ions

< 250 mg/dm3

Nitrates and nitrites

< 10 mg/dm3

CSB

< 7 mg/dm3

Ammonia

< 5 mg/dm3

Iron

< 0, 2 mg/dm3

Manganese

< 0, 2 mg/dm3

Conductivity

< 2200 µS/cm

 

 

Residue on evaporation

< 500 mg/dm3

Potassium permanganate consumption

< 25 mg/dm3

Suspended matter

< 3 mg/dm3

Particular size range filtration

> 3 < 15 mg/dm3 part flow purification recommended

recommendations

> 15 mg/dm3 continuous purification recommended

Closed-loop water specifications

Raw water

Treated water system

 

 

 

pH

6.5–9.5

8.0–10.0

 

 

 

Specific conductance at 25°C

10–1,000 mhos

10–4,500 mhos

 

 

 

"M" Alkalinity (CaCO3)

20–300 ppm

100–1,000 ppm

Sulfur (SO4)

0–150 ppm

0–150 ppm

Chloride (Cl)

0–150 ppm

0–150 ppm

 

 

 

Hardness (CaCO3)

0–350 ppm

0–350 ppm

Calcium hardness (CaCO3)

0–200 ppm

0–200 ppm

Magnesium hardness (CaCO3)

0–150 ppm

0–150 ppm

Copper (Cu)

< 0.10 ppm

< 0.20 ppm

 

 

 

Iron (Fe)

< 3.0 ppm

< 3.0 ppm

 

 

 

Aluminum (Al)

0.5 ppm maximum

0.5 ppm maximum

 

 

 

Sodium (Na)

0–1,000 ppm

0–1,000 ppm

 

 

 

Silica (SiO2)

0–150 ppm

0–150 ppm

Zinc (Zn)

1.0 ppm maximum

1.0 ppm maximum

 

 

 

Manganese (Mn)

0.1 ppm maximum

0.1 ppm maximum

 

 

 

Phosphate Ortho- (PO4)

3 ppm

3 ppm

Nitrite (NO2)

700–1,200 ppm

700–1,200 ppm

Water quality and leveling requirements, and condensation management 65

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Contents Part Number February 2007 Second Edition HP Modular Cooling System User GuideAudience assumptions Contents Replaceable parts and maintenance and service information Introduction OverviewReference Site preparation Configuration factorsOptimum environment and site requirements MCS kit contents InstallationRequired tools Rack hardware kit contentsInstalling the MCS unit Installation Installation Installation Installation Installation Powering up and configuring the unit Installation Installation Installation Installation Installation Enter 4 Activate Actual Values Return to the Main Menu Network Configuration screenInstallation Installation Configuring the IP address through the web interface Installation Installation Installation Installation Management module overview Management moduleManagement module components Reference Description Logging in through the terminal emulation programWeb interface requirements Accessing the management module through the web interfaceSoftware Browser Logging in through the web interfaceTo add an external alarm relay Connecting an external alarm relayManagement module HP Modular Cooling System Utility overview Serial interfaceOption number Submenu Description Main menuMenu Network Configuration submenu IP Configuration submenu Change Passwords submenu Info Factory Default submenu Configuring HyperTerminalConfiguring Minicom Operator display components Operator displayOperator display overview Indicators Meaning Sensors Sensors Water group sensor Snmp notification Type of message Solution Solution Uneven heat load Indicators Meaning Page Indicators Meaning Has been exceeded or the water flow is less than 2 l/min Indicators Meaning Adjusting the operator display Operator display Automatic Door Release Kit Overview Automatic Door Release KitQuestion Answer Frequently asked questionsHP Modular Cooling System frequently asked questions Port x set out lf=strip Issue Resolution TroubleshootingHP Modular Cooling System troubleshooting Specification SpecificationsMCS specifications Environmental specifications HP 10642 G2 Rack specificationsFeatures Specifications Thermal and air flow performanceMaintenance and service Replaceable parts and maintenance and service informationAir and water heat exchanger maintenance Replaceable partsAcceptable water quality range Water quality requirements and specificationsCooling water composition guidelines CSB Hydrological data Acceptable rangeAdjust the MCS leveling feet so that the unit is level Monitoring the quality of cooling solutionsLeveling requirements Frost damageCondensation management Before you contact HP Technical supportHP contact information Customer Self RepairRéparation par le client CSR Riparazione da parte del cliente Reparaciones del propio cliente Reparo feito pelo cliente Technical support Technical support Technical support Regulatory compliance identification numbers Regulatory compliance noticesFederal Communications Commission notice ModificationsEuropean Union regulatory notice CablesCanadian notice Regulatory compliance notices Taiwan battery recycling notice Battery replacement noticePower cord statement for Japan Acronyms and abbreviations Systems Insight Manager Power distribution unitSimple Mail Transfer Protocol Simple Network Management ProtocolIndex Index
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Modular Cooling System specifications

The HP Modular Cooling System (MCS) is a state-of-the-art solution designed to efficiently manage the heat generated by high-density IT environments. As data centers face the ever-increasing demand for processing power, traditional cooling methods often fall short, leading to inefficiencies and raised energy costs. The HP MCS addresses this issue with a scalable, flexible design that optimizes cooling performance while minimizing energy consumption.

One of the main features of the HP Modular Cooling System is its modular architecture, which allows for easy expansion and customization based on the specific needs of a data center. This scalability means that as a facility grows or changes, the cooling system can be modified without the need for extensive renovations or replacements. The MCS can be installed in various configurations, further enhancing its versatility.

The technology behind the HP MCS includes advanced cooling methods such as direct evaporative cooling and chilled water cooling. Direct evaporative cooling utilizes the principles of evaporative heat exchange to cool air without excessive energy consumption, making it an eco-friendly choice. In contrast, chilled water cooling uses a network of pipes filled with chilled water to remove heat from the server environment efficiently. This combination allows the MCS to adapt to various heat loads and ambient conditions.

Another notable characteristic of the HP Modular Cooling System is its intelligent controls and sensors. These components continually monitor temperature and humidity levels within the data center, automatically adjusting cooling output to maintain optimal conditions. This proactive approach helps to prevent overheating, reduces energy usage, and ensures the longevity of IT equipment.

Energy efficiency is further enhanced through the MCS's integration with HP's monitoring and management software. This software analyzes cooling performance trends, providing actionable insights for facility managers, enabling them to make informed decisions regarding cooling strategies. Additionally, the system is designed with environmentally sustainable practices in mind, aligning with global initiatives to reduce carbon footprints and promote green technology.

The HP Modular Cooling System stands out for its combination of innovative technologies, flexibility, and a commitment to energy efficiency. As data centers continue to evolve, the MCS remains a crucial asset in the pursuit of optimized performance and sustainability, providing a reliable solution to meet the demanding cooling needs of modern IT infrastructure.