Intel mPGA604 Mechanical Requirements, Mechanical Supports, Materials, Socket Standoff Height

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3Mechanical Requirements

3.1Mechanical Supports

A retention system needs to isolate any load in excess of 50 lbf, compressive, from the socket during the shock and vibration conditions outlined in Sections 5. The socket must pass the mechanical shock and vibration requirements listed in Sections 5 with the associated heatsink and retention mechanism attached. socket can only be attached by the 603 contacts to the motherboard. No external (i.e. screw, extra solder, adhesive, etc.) methods to attach the socket are acceptable.

3.2Materials

3.2.1Socket Housing

Thermoplastic or equivalent, UL 94V-0 flame rating, temperature rating and design capable of withstanding a temperature of 240° C for 40sec (minimum) typical of a reflow profile for solder material used on the socket. The material must have a thermal coefficient of expansion in the XY plane capable of passing reliability tests rated for an expected high operating temperature, mounted on FR4-type motherboard material.

3.2.2Color

The color of the socket can be optimized to provide the contrast needed for OEM’s pick and place vision systems. The base and cover of the socket may be different colors as long as they meet the above requirement.

3.3Cutouts for Package Removal

Recessed cutouts are required in the side of the socket to provide better access to the package substrate, and facilitate the manual removal of inserted package. Figure A-6.

3.4Socket Standoff Height

Socket stand off height, cover lead in and cover lead in depth must not interfere with package pin shoulder at worst-case conditions. The processor (not the pin shoulder) must sit flush on the socket standoffs and the pin field cannot contact the standoffs. Figure A-5.

mPGA604 Socket Design Guidelines

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Contents MPGA604 Socket MPGA604 Socket Design Guidelines Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors This page intentionally left blank Objective IntroductionPurpose ScopeIntroduction Assembled Component Description Assembled Component and Package DescriptionPackage Description Assembled Component and Package Description Mechanical Supports Mechanical RequirementsMaterials Cutouts for Package RemovalName MarkingsLock Closed and Unlock Open Markings Lot TraceabilitySocket Size Contact CharacteristicsSocket/Package Translation During Actuation Orientation in Packaging, Shipping and HandlingLever Actuation Requirements Material and Recycling RequirementsSocket Engagement/Disengagement Force Visual AidsSocket Critical-to-Function Dimensions Critical-to-Function DimensionsThis page intentionally left blank Electrical Requirements for Sockets Electrical RequirementsMethodology for Measuring Total Electrical Resistance Electrical ResistanceElectrical Resistance Fixtures Superimposed Electrical Requirements Daisy Inductance Determination of Maximum Electrical ResistanceInductance Measurement Fixture Cross-Section Design Procedure for Inductance MeasurementsMeasurement Steps Correlation of Measurement and Model Data InductanceDielectric Withstand Voltage Pin-to-Pin CapacitanceInsulation Resistance Contact Current RatingThis page intentionally left blank Use Conditions Environment Environmental RequirementsPlating Thickness Porosity TestSolvent Resistance SolderabilityDurability This page intentionally left blank Validation Testing Requirements Socket Test Plan Quality Assurance RequirementsMechanical Samples Socket Validation NotificationSafety Requirements Safety Requirements Documentation Requirements Documentation Requirements Appendix a Figure A-1 .5 mm, 604-Pin Package Assembly Drawing Sheet 1Figure A-2 .5 mm, 604-Pin Package Assembly Drawing Sheet 2 Figure A-3 .5 mm, 604-Pin Package Assembly Drawing Sheet 3 Appendix a Figure A-5. mPGA604 Socket Drawing Sheet 2 Figure A-6. mPGA604 Socket Drawing Sheet 3 Figure A-7 -Pin Interposer Assembly Drawing Sheet 1 Figure A-8 -Pin Interposer Assembly Drawing Sheet 2 Figure A-9 -Pin Interposer Assembly Drawing Sheet 3 Figure A-10 -Pin Interposer Assembly Drawing Sheet 4 Figure A-11 -Pin Interposer Assembly Drawing Sheet 5 Figure A-12 -Pin Interposer Assembly Drawing Sheet 6 Figure A-13 -Pin Interposer Assembly Drawing Sheet 7 This page intentionally left blank

mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.