Intel mPGA604 manual Name, Lock Closed and Unlock Open Markings, Lot Traceability

Page 14

Mechanical Requirements

Proper seating

3.5Markings

R

All markings required in this section must be able to withstand a temperature of 240° C for 40 seconds (minimum) typical of a reflow profile for solder material used on the socket, as well as any environmental test procedure outlined in Section 5.

3.5.1Name

mPGA604 (font type is Helvetica Bold – minimum 6 point).

This mark shall be molded or Laser Marked into the processor side of the socket housing.

Manufacturer’s insignia (font size at supplier’s discretion).

This mark will be molded or laser marked into the socket housing. Both marks must be visible when first seated in the motherboard. Any request for variation from this marking requires a written description (detailing size and location) to be provided to Intel for approval.

3.5.2Lock (Closed) and Unlock (Open) Markings

The universal symbols for ‘Lock’ and ‘Unlock’ are to be marked on the socket in the appropriate positions. Clear indicator marks must be located on the actuation mechanism that identifies the lock (closed) and unlock (open) positions of the cover as well as the actuation direction. These marks should still be visible after a package is inserted into the socket.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Lock (closed)

Unlock (open)

 

 

 

 

 

 

3.5.3Lot Traceability

Each socket will be marked with a lot identification code that will allow traceability of all components, date of manufacture (year and week), and assembly location. The mark must be placed on a surface that is visible when mounted on a printed circuit board. In addition, this identification code must be marked on the exterior of the box in which the units ship.

14

mPGA604 Socket Design Guidelines

Page 13 Page 15
Image 14
Page 13 Page 15
Contents MPGA604 Socket MPGA604 Socket Design Guidelines Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors This page intentionally left blank Purpose IntroductionObjective ScopeIntroduction Package Description Assembled Component and Package DescriptionAssembled Component Description Assembled Component and Package Description Materials Mechanical RequirementsMechanical Supports Cutouts for Package RemovalLock Closed and Unlock Open Markings MarkingsName Lot TraceabilitySocket/Package Translation During Actuation Contact CharacteristicsSocket Size Orientation in Packaging, Shipping and HandlingSocket Engagement/Disengagement Force Material and Recycling RequirementsLever Actuation Requirements Visual AidsCritical-to-Function Dimensions Socket Critical-to-Function DimensionsThis page intentionally left blank Electrical Requirements Electrical Requirements for SocketsElectrical Resistance Methodology for Measuring Total Electrical ResistanceElectrical Resistance Fixtures Superimposed Electrical Requirements Daisy Determination of Maximum Electrical Resistance InductanceDesign Procedure for Inductance Measurements Inductance Measurement Fixture Cross-SectionCorrelation of Measurement and Model Data Inductance Measurement StepsInsulation Resistance Pin-to-Pin CapacitanceDielectric Withstand Voltage Contact Current RatingThis page intentionally left blank Environmental Requirements Use Conditions EnvironmentSolvent Resistance Porosity TestPlating Thickness SolderabilityDurability This page intentionally left blank Validation Testing Requirements Mechanical Samples Quality Assurance RequirementsSocket Test Plan Socket Validation NotificationSafety Requirements Safety Requirements Documentation Requirements Documentation Requirements Figure A-1 .5 mm, 604-Pin Package Assembly Drawing Sheet 1 Appendix aFigure A-2 .5 mm, 604-Pin Package Assembly Drawing Sheet 2 Figure A-3 .5 mm, 604-Pin Package Assembly Drawing Sheet 3 Appendix a Figure A-5. mPGA604 Socket Drawing Sheet 2 Figure A-6. mPGA604 Socket Drawing Sheet 3 Figure A-7 -Pin Interposer Assembly Drawing Sheet 1 Figure A-8 -Pin Interposer Assembly Drawing Sheet 2 Figure A-9 -Pin Interposer Assembly Drawing Sheet 3 Figure A-10 -Pin Interposer Assembly Drawing Sheet 4 Figure A-11 -Pin Interposer Assembly Drawing Sheet 5 Figure A-12 -Pin Interposer Assembly Drawing Sheet 6 Figure A-13 -Pin Interposer Assembly Drawing Sheet 7 This page intentionally left blank

mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.
Top Page Image Contents