Intel mPGA604 Material and Recycling Requirements, Lever Actuation Requirements, Visual Aids

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Mechanical Requirements

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3.9.6Lubricants

For the final assembled product, no lubricant is permitted on the socket contacts. If lubricants are used elsewhere within the socket assembly, these lubricants must not be able to migrate to the socket contacts.

3.10Material and Recycling Requirements

Cadmium shall not be used in the painting or plating of the socket.

CFCs and HFCs shall not be used in manufacturing the socket. It is recommended that any plastic component exceeding 25g must be recyclable as per the European Blue Angel recycling design guidelines.

3.11Lever Actuation Requirements

•Lever closed direction – right.

•Actuation direction called out in Figure A-5.

•135° lever travel max.

•Pivot point in the center of the actuation area on the top of the socket. Figure A-6.

3.12Socket Engagement/Disengagement Force

The force on the actuation lever arm must not exceed 44N to engage or disengage the package into the mPGA604 socket. Movement of the cover is limited to the plane parallel to the motherboard. The processor package must not be utilized in the actuation of the socket. Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces).

3.13Visual Aids

The socket top will have markings identifying Pin 1. This marking will be represented by a clearly visible triangular symbol. See Figure A-6.

3.14Socket BGA Co-Planarity

The co-planarity (profile) requirement for all solder balls on the underside of the socket is located in Figure A-5.

3.15Solder Ball True Position

The solder ball pattern has a true position requirement with respect to Datum A, B, and C (see Figure A-5).

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mPGA604 Socket Design Guidelines

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Contents MPGA604 Socket MPGA604 Socket Design Guidelines Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors This page intentionally left blank Introduction ObjectivePurpose ScopeIntroduction Assembled Component Description Assembled Component and Package DescriptionPackage Description Assembled Component and Package Description Mechanical Requirements Mechanical SupportsMaterials Cutouts for Package RemovalMarkings NameLock Closed and Unlock Open Markings Lot TraceabilityContact Characteristics Socket SizeSocket/Package Translation During Actuation Orientation in Packaging, Shipping and HandlingMaterial and Recycling Requirements Lever Actuation RequirementsSocket Engagement/Disengagement Force Visual AidsCritical-to-Function Dimensions Socket Critical-to-Function DimensionsThis page intentionally left blank Electrical Requirements Electrical Requirements for SocketsElectrical Resistance Methodology for Measuring Total Electrical ResistanceElectrical Resistance Fixtures Superimposed Electrical Requirements Daisy Determination of Maximum Electrical Resistance InductanceDesign Procedure for Inductance Measurements Inductance Measurement Fixture Cross-SectionCorrelation of Measurement and Model Data Inductance Measurement StepsPin-to-Pin Capacitance Dielectric Withstand VoltageInsulation Resistance Contact Current RatingThis page intentionally left blank Environmental Requirements Use Conditions EnvironmentPorosity Test Plating ThicknessSolvent Resistance SolderabilityDurability This page intentionally left blank Validation Testing Requirements Quality Assurance Requirements Socket Test PlanMechanical Samples Socket Validation NotificationSafety Requirements Safety Requirements Documentation Requirements Documentation Requirements Figure A-1 .5 mm, 604-Pin Package Assembly Drawing Sheet 1 Appendix aFigure A-2 .5 mm, 604-Pin Package Assembly Drawing Sheet 2 Figure A-3 .5 mm, 604-Pin Package Assembly Drawing Sheet 3 Appendix a Figure A-5. mPGA604 Socket Drawing Sheet 2 Figure A-6. mPGA604 Socket Drawing Sheet 3 Figure A-7 -Pin Interposer Assembly Drawing Sheet 1 Figure A-8 -Pin Interposer Assembly Drawing Sheet 2 Figure A-9 -Pin Interposer Assembly Drawing Sheet 3 Figure A-10 -Pin Interposer Assembly Drawing Sheet 4 Figure A-11 -Pin Interposer Assembly Drawing Sheet 5 Figure A-12 -Pin Interposer Assembly Drawing Sheet 6 Figure A-13 -Pin Interposer Assembly Drawing Sheet 7 This page intentionally left blank

mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.
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