Intel mPGA604 manual Socket Critical-to-Function Dimensions

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Mechanical Requirements

3.16Critical-to-Function Dimensions

The mPGA604 socket shall accept a 604-pin processor pin field. All dimensions are metric. Asymmetric features are designed to properly align the socket to the motherboard and prevent the socket from being assembled incorrectly to the motherboard.

Critical-to-function (CTF) dimensions are identified in Table 3-1.The CTF values are detailed on the mPGA604 socket drawing in Figure A-5and Figure A-6and take precedence over all values presented in this document. Dimensional requirements identified in the drawings and in Table 3-1must be met. These dimensions will be verified as part of the validation process. Also, supplier will provide and maintain Critical Process Parameters controlling these CTFs or will provide direct measurements to meet ongoing quality requirements.

Table 3-1. Socket Critical-to-Function Dimensions

Dimension

Socket Length

Socket Width

Socket Height (Interposer surface from MB)

Assembled Seating Plane Flatness

Ball Diameter

True Position of Balls (pattern relating)

Co-planarity (profile) of Balls

Actuation Distance (Cover Travel)

Through Cavity X

Through Cavity Y

Cover Hole Diameter (Must guarantee ZIF)

Cover Hole Countersink Depth (Must guarantee ZIF)

Cover Hole Countersink Diameter (Must guarantee ZIF)

Cover Hole Virtual Condition (Pattern Locating)

Cover Hole Virtual Condition (Feature Relating)

Cover Hole Field Depth wrt Seating Plane

Cover Thickness in Hole area

Au Thickness

Ni Thickness

Alignment Post Virtual Condition

Contact Depth from Seating Plane

mPGA604 Socket Design Guidelines

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Contents MPGA604 Socket MPGA604 Socket Design Guidelines Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors This page intentionally left blank Objective IntroductionPurpose ScopeIntroduction Package Description Assembled Component and Package DescriptionAssembled Component Description Assembled Component and Package Description Mechanical Supports Mechanical RequirementsMaterials Cutouts for Package RemovalName MarkingsLock Closed and Unlock Open Markings Lot TraceabilitySocket Size Contact CharacteristicsSocket/Package Translation During Actuation Orientation in Packaging, Shipping and HandlingLever Actuation Requirements Material and Recycling RequirementsSocket Engagement/Disengagement Force Visual AidsSocket Critical-to-Function Dimensions Critical-to-Function DimensionsThis page intentionally left blank Electrical Requirements for Sockets Electrical RequirementsMethodology for Measuring Total Electrical Resistance Electrical ResistanceElectrical Resistance Fixtures Superimposed Electrical Requirements Daisy Inductance Determination of Maximum Electrical ResistanceInductance Measurement Fixture Cross-Section Design Procedure for Inductance MeasurementsMeasurement Steps Correlation of Measurement and Model Data InductanceDielectric Withstand Voltage Pin-to-Pin CapacitanceInsulation Resistance Contact Current RatingThis page intentionally left blank Use Conditions Environment Environmental RequirementsPlating Thickness Porosity TestSolvent Resistance SolderabilityDurability This page intentionally left blank Validation Testing Requirements Socket Test Plan Quality Assurance RequirementsMechanical Samples Socket Validation NotificationSafety Requirements Safety Requirements Documentation Requirements Documentation Requirements Appendix a Figure A-1 .5 mm, 604-Pin Package Assembly Drawing Sheet 1Figure A-2 .5 mm, 604-Pin Package Assembly Drawing Sheet 2 Figure A-3 .5 mm, 604-Pin Package Assembly Drawing Sheet 3 Appendix a Figure A-5. mPGA604 Socket Drawing Sheet 2 Figure A-6. mPGA604 Socket Drawing Sheet 3 Figure A-7 -Pin Interposer Assembly Drawing Sheet 1 Figure A-8 -Pin Interposer Assembly Drawing Sheet 2 Figure A-9 -Pin Interposer Assembly Drawing Sheet 3 Figure A-10 -Pin Interposer Assembly Drawing Sheet 4 Figure A-11 -Pin Interposer Assembly Drawing Sheet 5 Figure A-12 -Pin Interposer Assembly Drawing Sheet 6 Figure A-13 -Pin Interposer Assembly Drawing Sheet 7 This page intentionally left blank

mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.
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