Intel mPGA604 manual Figures

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5

Environmental Requirements

29

 

5.1

Porosity Test

30

 

 

5.1.1

Porosity Test Method

30

 

 

5.1.2

Porosity Test Criteria

30

 

5.2

Plating Thickness

30

 

5.3

Solvent Resistance

30

 

5.4

Solderability

30

 

5.5

Durability

31

6

Validation Testing Requirements

33

 

6.1

Applicable Documents

33

 

6.2

Testing Facility

33

 

6.3

Funding

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33

 

6.4

Socket Design Verification

33

 

6.5

Reporting

33

 

6.6

Process Changes

33

 

6.7

Quality Assurance Requirements

34

 

6.8

Socket Test Plan

34

 

 

6.8.1 Submission of an mPGA604 Socket for Validation Testing

34

 

6.9

Mechanical Samples

34

 

6.10

Socket Validation Notification

34

 

6.11

Production Lot Definition

34

 

6.12

Socket Validation

34

7

Safety Requirements

35

8

Documentation Requirements

37

A

Appendix A

 

 

 

 

39

Figures

 

 

 

 

 

 

 

 

 

 

 

 

Figure 4-1. Methodology for Measuring Total Electrical Resistance

20

 

Figure 4-2. Methodology for Measuring Electrical Resistance of the Jumper

20

 

Figure 4-3. Electrical Resistance Fixtures Superimposed

21

 

Figure 4-4. Inductance Measurement Fixture Cross-Section

25

 

Figure 4-5. Inductance and Capacitance Fixture

25

 

Figure 5-1. Flowchart of Knowledge-Based Reliability Evaluation Methodology

29

 

Figure A-1. 42.5 mm, 604-Pin Package Assembly Drawing (Sheet 1 of 3)

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Figure A-2. 42.5 mm, 604-Pin Package Assembly Drawing (Sheet 2 of 3)

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Figure A-3. 42.5 mm, 604-Pin Package Assembly Drawing (Sheet 3 of 3)

41

 

Figure A-4. mPGA604 Socket Drawing (Sheet 1 of 3)

42

 

Figure A-5. mPGA604 Socket Drawing (Sheet 2 of 3)

43

 

Figure A-6. mPGA604 Socket Drawing (Sheet 3 of 3)

44

 

Figure A-7.603-Pin Interposer Assembly Drawing (Sheet 1 of 7)

45

 

Figure A-8.603-Pin Interposer Assembly Drawing (Sheet 2 of 7)

46

 

Figure A-9.603-Pin Interposer Assembly Drawing (Sheet 3 of 7)

47

 

Figure A-10.603-Pin Interposer Assembly Drawing (Sheet 4 of 7)

48

 

Figure A-11.603-Pin Interposer Assembly Drawing (Sheet 5 of 7)

49

 

Figure A-12.603-Pin Interposer Assembly Drawing (Sheet 6 of 7)

50

 

Figure A-13.603-Pin Interposer Assembly Drawing (Sheet 7 of 7)

51

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mPGA604 Socket Design Guidelines

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Contents MPGA604 Socket MPGA604 Socket Design Guidelines Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors This page intentionally left blank Introduction ObjectivePurpose ScopeIntroduction Assembled Component Description Assembled Component and Package DescriptionPackage Description Assembled Component and Package Description Mechanical Requirements Mechanical SupportsMaterials Cutouts for Package RemovalMarkings NameLock Closed and Unlock Open Markings Lot TraceabilityContact Characteristics Socket SizeSocket/Package Translation During Actuation Orientation in Packaging, Shipping and HandlingMaterial and Recycling Requirements Lever Actuation RequirementsSocket Engagement/Disengagement Force Visual AidsCritical-to-Function Dimensions Socket Critical-to-Function DimensionsThis page intentionally left blank Electrical Requirements Electrical Requirements for SocketsElectrical Resistance Methodology for Measuring Total Electrical ResistanceElectrical Resistance Fixtures Superimposed Electrical Requirements Daisy Determination of Maximum Electrical Resistance InductanceDesign Procedure for Inductance Measurements Inductance Measurement Fixture Cross-SectionCorrelation of Measurement and Model Data Inductance Measurement StepsPin-to-Pin Capacitance Dielectric Withstand VoltageInsulation Resistance Contact Current RatingThis page intentionally left blank Environmental Requirements Use Conditions EnvironmentPorosity Test Plating ThicknessSolvent Resistance SolderabilityDurability This page intentionally left blank Validation Testing Requirements Quality Assurance Requirements Socket Test PlanMechanical Samples Socket Validation NotificationSafety Requirements Safety Requirements Documentation Requirements Documentation Requirements Figure A-1 .5 mm, 604-Pin Package Assembly Drawing Sheet 1 Appendix aFigure A-2 .5 mm, 604-Pin Package Assembly Drawing Sheet 2 Figure A-3 .5 mm, 604-Pin Package Assembly Drawing Sheet 3 Appendix a Figure A-5. mPGA604 Socket Drawing Sheet 2 Figure A-6. mPGA604 Socket Drawing Sheet 3 Figure A-7 -Pin Interposer Assembly Drawing Sheet 1 Figure A-8 -Pin Interposer Assembly Drawing Sheet 2 Figure A-9 -Pin Interposer Assembly Drawing Sheet 3 Figure A-10 -Pin Interposer Assembly Drawing Sheet 4 Figure A-11 -Pin Interposer Assembly Drawing Sheet 5 Figure A-12 -Pin Interposer Assembly Drawing Sheet 6 Figure A-13 -Pin Interposer Assembly Drawing Sheet 7 This page intentionally left blank

mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.