Intel mPGA604 manual Assembled Component and Package Description, Assembled Component Description

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2Assembled Component and Package Description

Information provided in this section is to ensure dimensional compatibility of the mPGA604 socket with that of the 604-pin processor package. The processor package must be inserted into the mPGA604 socket with zero insertion force when the socket is not actuated.

2.1Assembled Component Description

The assembled component may consist of a heatsink, EMI shield, clips, fan, retention mechanism (RM), and processor package. Specific details can be obtained from Thermal Design Guidelines, consult your Intel field representative to obtain this document.

2.2Package Description

The outline of the processor package that can be used with the mPGA604 socket is illustrated in Figure A-1.This drawing does not include potential heatsinks since these are used at the OEM's discretion.

The pin-out for the 604-pin processor package is shown in Figure A-2.

The pin dimension details, base material, plating material and plating thickness are shown in Figure A-3.Note the dimensional variation when designing to ensure ZIF. The package Critical-To- Function (CTF) dimensions are presented in Table 2-1.CTF values are detailed on the processor package drawings and take precedence over all values presented in this document.

Table 2-1. Package Critical-To-Function (CTF) Dimensions

Dimension

Shoulder Diameter (Land Solder Fillet Shoulder Inclusion)

Pin Diameter

Shoulder Diameter Protrusion (Land Solder Fillet Shoulder

Inclusion)

Pin Length (Effective)*

Pin True Position (Pattern Relating and Feature Relating)*

Flatness of Processor*

Note: Pin length, pin true position and flatness tolerances are controlled by Geometric Dimensioning and Tolerancing (GD&T) controls.

mPGA604 Socket Design Guidelines

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Contents MPGA604 Socket MPGA604 Socket Design Guidelines Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors This page intentionally left blank Scope IntroductionObjective PurposeIntroduction Package Description Assembled Component and Package DescriptionAssembled Component Description Assembled Component and Package Description Cutouts for Package Removal Mechanical RequirementsMechanical Supports MaterialsLot Traceability MarkingsName Lock Closed and Unlock Open MarkingsOrientation in Packaging, Shipping and Handling Contact CharacteristicsSocket Size Socket/Package Translation During ActuationVisual Aids Material and Recycling RequirementsLever Actuation Requirements Socket Engagement/Disengagement ForceSocket Critical-to-Function Dimensions Critical-to-Function DimensionsThis page intentionally left blank Electrical Requirements for Sockets Electrical RequirementsMethodology for Measuring Total Electrical Resistance Electrical ResistanceElectrical Resistance Fixtures Superimposed Electrical Requirements Daisy Inductance Determination of Maximum Electrical ResistanceInductance Measurement Fixture Cross-Section Design Procedure for Inductance MeasurementsMeasurement Steps Correlation of Measurement and Model Data InductanceContact Current Rating Pin-to-Pin CapacitanceDielectric Withstand Voltage Insulation ResistanceThis page intentionally left blank Use Conditions Environment Environmental RequirementsSolderability Porosity TestPlating Thickness Solvent ResistanceDurability This page intentionally left blank Validation Testing Requirements Socket Validation Notification Quality Assurance RequirementsSocket Test Plan Mechanical SamplesSafety Requirements Safety Requirements Documentation Requirements Documentation Requirements Appendix a Figure A-1 .5 mm, 604-Pin Package Assembly Drawing Sheet 1Figure A-2 .5 mm, 604-Pin Package Assembly Drawing Sheet 2 Figure A-3 .5 mm, 604-Pin Package Assembly Drawing Sheet 3 Appendix a Figure A-5. mPGA604 Socket Drawing Sheet 2 Figure A-6. mPGA604 Socket Drawing Sheet 3 Figure A-7 -Pin Interposer Assembly Drawing Sheet 1 Figure A-8 -Pin Interposer Assembly Drawing Sheet 2 Figure A-9 -Pin Interposer Assembly Drawing Sheet 3 Figure A-10 -Pin Interposer Assembly Drawing Sheet 4 Figure A-11 -Pin Interposer Assembly Drawing Sheet 5 Figure A-12 -Pin Interposer Assembly Drawing Sheet 6 Figure A-13 -Pin Interposer Assembly Drawing Sheet 7 This page intentionally left blank

mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.
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