Intel mPGA604 manual Electrical Requirements for Sockets

Page 19

R

4Electrical Requirements

Socket electrical requirements are measured from the socket-seating plane of the processor test vehicle (PTV) to the component side of the socket PCB to which it is attached. All specifications are maximum values (unless otherwise stated) for a single socket pin, but includes effects of adjacent pins where indicated. Pin and socket inductance includes exposed pin from mated contact to bottom of the processor pin field.

Table 4-1. Electrical Requirements for Sockets

1

Mat11 loop inductance, Lloop

<4.33nH

Refer to Table 4-2,Item 1

 

 

 

 

2

Mated partial mutual inductance, L

NA

Refer to Table 4-2,Item 2a

 

 

 

 

3

Maximum mutual capacitance, C

<1pF

Refer to Table 4-2,Item 3

4

Maximum Ave Contact Resistance

≤ 17mΩ

Refer to Table 4-2,Item 4

 

 

 

Refer to Section 4.1 for more detail.

 

 

 

Refer to mPGA603 Socket Design

 

 

 

Guidelines for electrical parameters

 

 

 

with INT3 packages.

5

Measurement frequency(s) for Pin-to-

400 MHz

 

 

Pin/Connector-to-Connector capacitance.

 

 

6

Measurement frequency(s) for Pin-to-

1 GHz

 

 

Pin/Connector-to-Connector inductance.

 

 

7

Dielectric Withstand Voltage

360 Volts RMS

 

 

 

 

 

8

Insulation Resistance

800 M Ohms

 

9

Contact Current Rating

Read and record

 

 

 

 

 

Table 4-2. Definitions

1

Mated loop inductance, Lloop

The inductance calculated for two conductors, considering

 

Refer to Table 4-1,Item 11

one forward conductor and one return conductor.

 

 

 

2a

Mated mutual inductance, L

The inductance on a conductor due to any single

 

Refer to Table 4-1,Item 2

neighboring conductor.

3

Maximum mutual capacitance, C

The capacitance between two pins/connectors.

 

Refer to Table 4-1,Item 3

 

4

Maximum Average Contact Resistance

The max average resistance target is originally derived from

 

Refer to Table 4-1,Item 4

max resistance of each chain minus resistance of shorting

 

 

bars divided by number of pins in the daisy chain.

 

 

This value has to be satisfied at all time. Thus, this is the

 

 

spec valid at End of Line, End of Life and etc.

 

 

Socket Contact Resistance: The resistance of the socket

 

 

contact, interface resistance to the pin, and the entire pin to

 

 

the point where the pin enters the interposer; gaps included.

5

Measurement frequency(s) for Capacitance

Capacitively dominate region. This is usually the lowest

 

 

measurable frequency. This should be determined from the

 

 

measurements done for the feasibility.

6

Measurement frequency(s) for Inductance

Linear region. This is usually found at higher frequency

 

 

ranges. This should be determined from the measurements

 

 

done for the feasibility.

mPGA604 Socket Design Guidelines

19

Page 18 Page 20
Image 19
Page 18 Page 20
Contents MPGA604 Socket MPGA604 Socket Design Guidelines Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors This page intentionally left blank Scope IntroductionObjective PurposeIntroduction Assembled Component Description Assembled Component and Package DescriptionPackage Description Assembled Component and Package Description Cutouts for Package Removal Mechanical RequirementsMechanical Supports MaterialsLot Traceability MarkingsName Lock Closed and Unlock Open MarkingsOrientation in Packaging, Shipping and Handling Contact CharacteristicsSocket Size Socket/Package Translation During ActuationVisual Aids Material and Recycling RequirementsLever Actuation Requirements Socket Engagement/Disengagement ForceSocket Critical-to-Function Dimensions Critical-to-Function DimensionsThis page intentionally left blank Electrical Requirements for Sockets Electrical RequirementsMethodology for Measuring Total Electrical Resistance Electrical ResistanceElectrical Resistance Fixtures Superimposed Electrical Requirements Daisy Inductance Determination of Maximum Electrical ResistanceInductance Measurement Fixture Cross-Section Design Procedure for Inductance MeasurementsMeasurement Steps Correlation of Measurement and Model Data InductanceContact Current Rating Pin-to-Pin CapacitanceDielectric Withstand Voltage Insulation ResistanceThis page intentionally left blank Use Conditions Environment Environmental RequirementsSolderability Porosity TestPlating Thickness Solvent ResistanceDurability This page intentionally left blank Validation Testing Requirements Socket Validation Notification Quality Assurance RequirementsSocket Test Plan Mechanical SamplesSafety Requirements Safety Requirements Documentation Requirements Documentation Requirements Appendix a Figure A-1 .5 mm, 604-Pin Package Assembly Drawing Sheet 1Figure A-2 .5 mm, 604-Pin Package Assembly Drawing Sheet 2 Figure A-3 .5 mm, 604-Pin Package Assembly Drawing Sheet 3 Appendix a Figure A-5. mPGA604 Socket Drawing Sheet 2 Figure A-6. mPGA604 Socket Drawing Sheet 3 Figure A-7 -Pin Interposer Assembly Drawing Sheet 1 Figure A-8 -Pin Interposer Assembly Drawing Sheet 2 Figure A-9 -Pin Interposer Assembly Drawing Sheet 3 Figure A-10 -Pin Interposer Assembly Drawing Sheet 4 Figure A-11 -Pin Interposer Assembly Drawing Sheet 5 Figure A-12 -Pin Interposer Assembly Drawing Sheet 6 Figure A-13 -Pin Interposer Assembly Drawing Sheet 7 This page intentionally left blank

mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.
Top Page Image Contents