Intel mPGA604 manual Determination of Maximum Electrical Resistance, Inductance

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Electrical Requirements

R

4.2Determination of Maximum Electrical Resistance

This section provides a guideline for the instruments used to take the measurements.

Note: The instrument selection should consider the guidelines in EIA 364-23A.

1.These measurements use a 4-wire technique, where the instruments provide two separate circuits. One is a precision current source to deliver the test current. The other is a precision voltmeter circuit to measure the voltage drop between the desired points.

2.These separate circuits can be contained within one instrument, such as a high quality micro- ohmmeter, a stand-alone current source and voltmeter, or the circuits of a data acquisition system.

3. Measurement accuracy in Ω is specified as ± 0.1% of reading, or ± 0.1 m Ω , whichever is greater. The vendor is responsible for demonstrating that their instrument(s) can meet this accuracy.

4.Automation of the measurements can be implemented by scanning the chains through the edge or cable test connector using a switch matrix. The matrix can be operated by hand, or through software.

5.Measure RTotal for each daisy chain of “package + socket + motherboard” unit.

6.Measure Rjumper for each daisy chain of 30 “package + motherboard” units. Calculate

R jumper for each daisy chain (There is 30 data for each daisy chain).

7.For each socket unit, calculate

R Req =

R Total −

R

jumper

N

 

RReq is the average contact resistance for socket pin.

4.3Inductance

The bottom fixture for the inductance measurement is a ground plane on the secondary side of the motherboard with all pins grounded. The component side of the socket PCB does not contain a plane. The top fixture is the package, which contains pins that will connect to the socket. Figure 4-4shows the inductance measurement fixture cross-section and the inductance measurement methodology. The first figure shows the entire assembly. The second figure shows the assembly without the socket; the socket-seating plane of the package is directly mounted to the component side of the socket PCB. This is used to calibrate out the fixture contribution. The materials for the fixture must match the materials used in the processor. Note the probe pad features exist on the topside of the top fixture, and the shorting plane exists only on the bottom side of the bottom fixture. Figure 4-5presents the inductance and capacitance fixture design.

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mPGA604 Socket Design Guidelines

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Contents MPGA604 Socket MPGA604 Socket Design Guidelines Contents Figures Tables Revision History Re-Validation Notice to Socket Vendors This page intentionally left blank Introduction ObjectivePurpose ScopeIntroduction Assembled Component and Package Description Assembled Component DescriptionPackage Description Assembled Component and Package Description Mechanical Requirements Mechanical SupportsMaterials Cutouts for Package RemovalMarkings NameLock Closed and Unlock Open Markings Lot TraceabilityContact Characteristics Socket SizeSocket/Package Translation During Actuation Orientation in Packaging, Shipping and HandlingMaterial and Recycling Requirements Lever Actuation RequirementsSocket Engagement/Disengagement Force Visual AidsCritical-to-Function Dimensions Socket Critical-to-Function DimensionsThis page intentionally left blank Electrical Requirements Electrical Requirements for SocketsElectrical Resistance Methodology for Measuring Total Electrical ResistanceElectrical Resistance Fixtures Superimposed Electrical Requirements Daisy Determination of Maximum Electrical Resistance InductanceDesign Procedure for Inductance Measurements Inductance Measurement Fixture Cross-SectionCorrelation of Measurement and Model Data Inductance Measurement StepsPin-to-Pin Capacitance Dielectric Withstand VoltageInsulation Resistance Contact Current RatingThis page intentionally left blank Environmental Requirements Use Conditions EnvironmentPorosity Test Plating ThicknessSolvent Resistance SolderabilityDurability This page intentionally left blank Validation Testing Requirements Quality Assurance Requirements Socket Test PlanMechanical Samples Socket Validation NotificationSafety Requirements Safety Requirements Documentation Requirements Documentation Requirements Figure A-1 .5 mm, 604-Pin Package Assembly Drawing Sheet 1 Appendix aFigure A-2 .5 mm, 604-Pin Package Assembly Drawing Sheet 2 Figure A-3 .5 mm, 604-Pin Package Assembly Drawing Sheet 3 Appendix a Figure A-5. mPGA604 Socket Drawing Sheet 2 Figure A-6. mPGA604 Socket Drawing Sheet 3 Figure A-7 -Pin Interposer Assembly Drawing Sheet 1 Figure A-8 -Pin Interposer Assembly Drawing Sheet 2 Figure A-9 -Pin Interposer Assembly Drawing Sheet 3 Figure A-10 -Pin Interposer Assembly Drawing Sheet 4 Figure A-11 -Pin Interposer Assembly Drawing Sheet 5 Figure A-12 -Pin Interposer Assembly Drawing Sheet 6 Figure A-13 -Pin Interposer Assembly Drawing Sheet 7 This page intentionally left blank

mPGA604 specifications

The Intel mPGA604 is a prominent socket specification that has become synonymous with performance in the realm of computing. Designed primarily for users requiring substantial processing power, the mPGA604 socket hosts a variety of Intel processors, notably including the Pentium II and Pentium III series, along with Xeon chips in various configurations. The integration of this technology has facilitated the development of powerful computing machines aimed at both enterprise and individual users.

One of the main features of the mPGA604 socket is its pin grid array configuration, which offers a secure mount for processors. This design allows for efficient heat dissipation and improved electrical connectivity, essential for maintaining the performance of high-end CPUs. The mPGA604 uses 604 pins that create a robust connection, allowing for stable and consistent data transfer between the CPU and the motherboard.

Another significant characteristic of mPGA604 is its support for a range of processor clock speeds and voltage specifications. The socket is integrated with technologies like Intel's SpeedStep, which dynamically adjusts the processor's voltage and frequency according to the workload. This helps in managing power consumption and heat generation, which is critical for longevity and reliability in computing systems.

The mPGA604 also introduces features like Multiple Processor support, enabling systems to leverage dual or even quad-processor configurations effectively. This capability significantly enhances computational performance, making the socket an excellent choice for server applications and high-performance workstations.

Moreover, the socket supports advanced memory technologies, such as SDRAM and RDIMM, allowing for flexible memory configurations tailored to specific performance needs. The ability to utilize dual-channel memory architectures maximizes throughput, facilitating improved application performance and system responsiveness.

In conclusion, the Intel mPGA604 socket represents a well-engineered solution catering to users seeking enhanced processing power and efficiency. Its combination of a robust pin configuration, power management technologies, multiple processor support, and compatibility with advanced memory standards makes it an indispensable choice for performance-driven computing solutions in both personal and professional environments. As computing demands continue to evolve, the mPGA604 stands as a testament to Intel's commitment to innovation and adaptability in the technology landscape.
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