Sharp R-21JCA-F Precautions for Using LEAD-FREE Solder, Employing lead-free solder, Soldering

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R-21JCA-F

PRECAUTIONS FOR USING LEAD-FREE SOLDER

1.Employing lead-free solder

The "Main PWB" of this model employs lead-free solder. This is indicated by the "LF" symbol printed on the PWB and in the service manual. The suffix letter indicates the alloy type of the solder.

Example:

Sn-Ag-Cu

Indicates lead-free solder of tin, silver and copper.

2.Using lead-free wire solder

When repairing a PWB with the "LF" symbol, only lead-free solder should be used. (Using normal tin/lead alloy solder may result in cold soldered joints and damage to printed patterns.)

As the melting point of lead-free solder is approximately 40˚C higher than tin/lead alloy solder, it is recommend that a dedicated bit is used, and that the iron temperature is adjusted accordingly.

3.Soldering

As the melting point of lead-free solder (Sn-Ag-Cu) is higher and has poorer wettability, (flow), to prevent damage to the land of the PWB, extreme care should be taken not to leave the bit in contact with the PWB for an extended period of time. Remove the bit as soon as a good flow is achieved. The high content of tin in lead free solder will cause premature corrosion of the bit. To reduce wear on the bit, reduce the temperature or turn off the iron when it is not required.

Leaving different types of solder on the bit will cause contamination of the different alloys, which will alter their characteristics, making good soldering more difficult. It will be necessary to clean and replace bits more often when using lead-free solder. To reduce bit wear, care should be taken to clean the bit thoroughly after each use.

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Contents Model R-21JCA-F Before Servicing Dont Touch Before Servicing When the testing is completedMicrowave Measurement Procedure RequirementsLeakage test Sharp Electronics Corporation Light Duty Commercial Microwave Oven 21JCA-F ForewordGeneral Information SpecificationMaximum width, depth and height Actual capacity for holding food is less10 6 Oven DiagramDescription of Operating Sequence OperationOFF Condition Cooking ConditionFM AM Figure O-1 Oven Schematic-OFF ConditionDescription and Function of Components Troubleshooting Guide Test Procedure Possible Case Defective PartsProblem Power Transformer Test Microwave Output PowerHigh Voltage Capacitor Test Thermal CUT-OUT Test 125˚C OvenThermal CUT-OUT Test 145˚C Magnetron Monitor Switch Test Door Sensing SwitchPrimary Interlock System Test Primary Interlock Relay RY1Control Panel Assembly Test Before testingNoise Filter Test Relay Test Test Procedures Letter Component TestSteps Occurrence Cause or Correction Description of LSI Touch Control Panel AssemblyPower source voltage Pin No Signal Description Auto clear terminalInternal clock oscillation frequency input setting Power source voltage +5VTouch Control Panel Servicing Other PrecautionsServicing of Touch Control Panel Servicing ToolsUsing lead-free wire solder Precautions for Using LEAD-FREE SolderEmploying lead-free solder SolderingComponent Replacement and Adjustment Procedure Power Transformer RemovalOuter Case Removal Control Panel Assembly Removal Magnetron RemovalOven Lamp and Lamp Socket Removal Antenna Motor Removal Positive Lock Connector NO-CASE Type RemovalCooling FAN Motor Removal Rear ViewPower Supply Cord Replacement Re-installRemoval Door Parts Removal Antenna Motor Shaft Replacement After any service, make sure of the followingRemoval Figure C-10. Stirrer Antenna Assembly Installation Installation of Ceramic ShelfHighvoltagecomponents PictorialDiagramCN-A3 Pin5mm Pitch Figure S-3. Printed Wiring Board Electric Parts Parts ListCabinet Parts Control Panel PartsDoor Parts HOW to Order Replacement PartsMiscellaneous SCREWS,NUTS and WashersOven and Cabinet Parts Control Panel Parts Copyright 2005 by Sharp Corporation ALL Rights Reserved Packing and Accessories