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CY7C1347G manual
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Contents
Main
CY7C1347G
4-Mbit (128K x 36) Pipelined Sync SRAM
Features
Functional Description
Selection Guide
Document #: 38-05516 Rev. *F Page 2 of 22
Block Diagram
ADDRESS REGISTER
OUTPUT REGISTERS
OUTPUT BUFFERS E
INPUT REGISTERS
CY7C1347G
Document #: 38-05516 Rev. *F Page 3 of 22
Pinouts
CY7C1347G
Figure 1. 100-Pin TQFP
CY7C1347G
Pinouts
2345671 A B C D E F G H J K L M N P R
891011
Document #: 38-05516 Rev. *F Page 5 of 22
Table 1. Pin Definitions Name IO Description
Functional Overview
Single Read Accesses
Single Write Accesses Initiated by ADSP
Single Write Accesses Initiated by ADSC
Burst Sequences
CY7C1347G
Page
Maximum Ratings
Operating Range
Electrical Characteristics
Capacitance
Thermal Resistance
AC Test Loads and Waveforms
Switching Characteristics
Switching Waveforms
Figure 5. Read Cycle Timing
CY7C1347G
Figure 6. Write Cycle Timing
Note 17.Full width write can be initiated by either GW LOW, or by GW HIGH, BWE LOW, and BWx LOW.
Figure 7. Read/Write Cycle Timing
Figure 8. ZZ Mode Timing
Ordering Information
Page
Package Diagrams
Figure 9. 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm), 51-85050
A
Page
Figure 11. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180
Package Diagrams
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
1.40 MAX.
-
NOTES : PACKAGE WEIGHT : 0.475g JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC
Document History Page
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