CY14E256L
Best Practices
nvSRAM products have been used effectively for over 15 years. While ease of use is one of the product’s main system values, experience gained working with hundreds of applications has resulted in the following suggestions as best practices:
■The nonvolatile cells in an nvSRAM are programmed on the test floor during final test and quality assurance. Incoming inspection routines at customer or contract manufacturer’s sites sometimes reprogram these values. Final NV patterns are typically repeating patterns of AA, 55, 00, FF, A5, or 5A. End product’s firmware should not assume an NV array is in a set programmed state. Routines that check memory content values to determine first time system configuration, cold or warm boot status, and so on should always program a unique NV pattern (for example, complex
Table 1. Hardware Mode Selection
manufacturing test to ensure these system routines work consistently.
■Power up boot firmware routines should rewrite the nvSRAM into the desired state. While the nvSRAM is shipped in a preset state, best practice is to again rewrite the nvSRAM into the desired state as a safeguard against events that might flip the bit inadvertently (program bugs, incoming inspection routines, and so on).
■The VCAP value specified in this data sheet includes a minimum and a maximum value size. Best practice is to meet this requirement and not exceed the maximum VCAP value because the higher inrush currents may reduce the reliability of the internal pass transistor. Customers that want to use a larger VCAP value to make sure there is extra store charge should discuss their VCAP size selection with Cypress to understand any impact on the VCAP voltage level at the end of a tRECALL period.
CE | WE | HSB |
| Mode | IO | Power |
H | X | H | X | Not Selected | Output High Z | Standby |
L | H | H | X | Read SRAM | Output Data | Active[1] |
L | L | H | X | Write SRAM | Input Data | Active |
X | X | L | X | Nonvolatile STORE | Output High Z | ICC2[2] |
L | H | H | 0x0E38 | Read SRAM | Output Data | Active[1, 3, 4, 5] |
|
|
| 0x31C7 | Read SRAM | Output Data | ICC2 |
|
|
| 0x03E0 | Read SRAM | Output Data |
|
|
|
| 0x3C1F | Read SRAM | Output Data |
|
|
|
| 0x303F | Read SRAM | Output Data |
|
|
|
| 0x0FC0 | Nonvolatile STORE | Output High Z |
|
L | H | H | 0x0E38 | Read SRAM | Output Data | Active[1, 3, 4, 5] |
|
|
| 0x31C7 | Read SRAM | Output Data |
|
|
|
| 0x03E0 | Read SRAM | Output Data |
|
|
|
| 0x3C1F | Read SRAM | Output Data |
|
|
|
| 0x303F | Read SRAM | Output Data |
|
|
|
| 0x0C63 | Nonvolatile RECALL | Output High Z |
|
Notes
1.I/O state assumes OE < VIL. Activation of nonvolatile cycles does not depend on state of OE.
2.HSB STORE operation occurs only if an SRAM WRITE has been done since the last nonvolatile cycle. After the STORE (if any) completes, the part goes into standby mode, inhibiting all operations until HSB rises.
3.CE and OE LOW and WE HIGH for output behavior.
4.The six consecutive addresses must be in the order listed. WE must be high during all six consecutive CE controlled cycles to enable a nonvolatile cycle.
5.While there are 15 addresses on the CY14E256L, only the lower 14 are used to control software modes.
Document Number: | Page 6 of 18 |
[+] Feedback