CY62146ESL MoBL→
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter | Description | Test Conditions | Max | Unit | |
CIN | Input Capacitance | TA = 25°C, f = 1 MHz, | 10 | pF | |
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| VCC = VCC(typ) |
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COUT | Output Capacitance | 10 | pF | ||
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Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter | Description | Test Conditions | TSOP II | Unit |
ΘJA | Thermal Resistance | Still Air, soldered on a 3 × 4.5 inch, | 77 | °C/W |
| (Junction to Ambient) | printed circuit board |
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ΘJC | Thermal Resistance |
| 13 | °C/W |
| (Junction to Case) |
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AC Test Loads and Waveforms
R1
VCC 
OUTPUT
30 pF 
INCLUDING
JIG AND
SCOPE
VCC |
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| ALL INPUT PULSES | |||||||||||
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| 90% |
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10% |
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| 90% |
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| 10% | |||||
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GND |
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| Fall Time = 1 V/ns | ||
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R2 Rise Time = 1 V/ns |
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Equivalent to: |
| THÉVENIN EQUIVALENT | ||||||||||||||||||
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| RTH | ||||||||
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| OUTPUT |
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| V TH | ||||||||
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Parameters | 2.5V | 3.0V | 5.0V | Unit |
R1 | 16667 | 1103 | 1800 | Ω |
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R2 | 15385 | 1554 | 990 | Ω |
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RTH | 8000 | 645 | 639 | Ω |
VTH | 1.20 | 1.75 | 1.77 | V |
Document #: | Page 4 of 12 |
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