CY62147DV30
Capacitance (for all packages)[10]
Parameter |
| Description | Test Conditions |
| Max. |
| Unit |
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CIN |
| Input Capacitance |
| TA = 25°C, f = 1 MHz, |
| 10 |
| pF |
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| VCC = VCC(typ) |
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COUT |
| Output Capacitance |
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| 10 |
| pF |
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Thermal Resistance[10] |
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Parameter | Description |
| Test Conditions | VFBGA | TSOP II |
| Unit | ||||
ΘJA | Thermal Resistance |
| Still Air, soldered on a 3 × 4.5 inch, | 72 | 75.13 |
| °C/W | ||||
| (Junction to Ambient) | printed circuit board |
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ΘJC | Thermal Resistance |
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| 8.86 | 8.95 |
| °C/W | ||
| (Junction to Case) |
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AC Test Loads and Waveforms[10]
R1
VCC
OUTPUT
50 pF
INCLUDING
JIG AND
SCOPE
VCC |
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| ALL INPUT PULSES | |||||||||||
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| 90% |
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10% |
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| 90% |
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| 10% | |||||
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GND |
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| Fall Time = 1 V/ns | ||
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R2 Rise Time = 1 V/ns |
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Equivalent to: |
| THÉVENIN EQUIVALENT | ||||||||||||||||||
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| RTH | ||||||||
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| OUTPUT |
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| V | ||||||||
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Parameters | 2.50V | 3.0V | Unit |
R1 | 16667 | 1103 | Ω |
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R2 | 15385 | 1554 | Ω |
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RTH | 8000 | 645 | Ω |
VTH | 1.20 | 1.75 | V |
Data Retention Characteristics (Over the Operating Range)
Parameter | Description | Conditions | Min. | Typ.[5] | Max. | Unit | |
VDR | VCC for Data Retention |
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| 1.5 |
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| V |
ICCDR | Data Retention Current | VCC= 1.5V | L |
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| 15 | ∝A |
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| CE > VCC – 0.2V, | LL |
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| 6 |
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| VIN > VCC – 0.2V or |
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| VIN < 0.2V |
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tCDR[10] | Chip Deselect to Data Retention |
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| 0 |
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| Time |
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tR[12] | Operation Recovery Time |
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| tRC |
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Data Retention Waveform[13]
| VCC(min) | DATA RETENTION MODE | VCC(min) |
VCC | VDR > 1.5 V | ||
CE or | tCDR |
| tR |
BHE.BLE |
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Notes:
10.Tested initially and after any design or process changes that may affect these parameters.
11.Test condition for the
12.Full device operation requires linear VCC ramp from VDR to VCC(min.) > 100 ∝s or stable at VCC(min.) > 100 ∝s.
13.BHE.BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE.
Document #: | Page 4 of 12 |
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