CY62167EV18 MoBL®
Document #: 38-05447 Rev. *G Page 2 of 13
Pin Configuration
Figure 1. 48-Ball VFBGA (6 x 7 x 1mm) / (6 x 8 x 1mm) Top View [1, 2, 3]
Product Portfolio
Product VCC Range (V) Speed
(ns)
Power Dissipation
Operating ICC (mA)
Standby ISB2 (μA)
f = 1 MHz f = fmax
Min Typ[4] Max Typ [4] Max Typ[4] Max Typ [4] Max
CY62167EV18LL 1.65 1.8 2.25 55 2.2 4.0 25 30 1.5 12
CY62167EV30LL[5]
WE
A11
A10
A6
A0
A3CE1
IO10
IO8
IO9
A4
A5
IO
11
IO13
IO12
IO14
IO15
V
SS
A9
A8
OE
Vss
A7
IO0
BHE
CE2
A17
A2
A1
BLE
V
CC
IO2
IO1
IO
3
IO4
IO5IO6
IO7
A15
A14
A13
A
12
A19
A18
NC
3
26
5
4
1
D
E
B
A
C
F
G
H
A16
NC
Vcc
Notes
1. The information related to 6 x 7 x 1 mm VFBGA package is preliminary.
2. NC pins are not connected on the die.
3. Ball H6 for the VFBGA package can be used to upgrade to a 32M density.
4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C.
5. This part can be operated in the VCC range of 1.65V–2.25V at 55ns speed. It can also be operated in the VCC range of 2.2V–3.6V at 45ns speed.
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