Cypress Pin Configuration, Product Portfolio, Min Typ Max CY62167EV18LL CY62167EV30LL, Ble Bhe

CY62167EV18 MoBL®

Pin Configuration

Figure 1. 48-Ball VFBGA (6 x 7 x 1mm) / (6 x 8 x 1mm) Top View [1, 2, 3]

1	2	3		4	5	6
BLE	OE	A0		A1	A2	CE2	A
IO8	BHE	A3		A4	CE1	IO0	B
IO9	IO 10	A5		A6	IO 1	IO 2	C
V	IO	A	17	A	IO	Vcc	D
SS	11			7	3
VCC	IO12	NC		A16	IO4	Vss	E
IO14	IO13	A14		A15	IO 5	IO6	F
IO15	A19	A12		A13	WE	IO7	G
A18	A8	A9		A10	A11	NC	H

Product Portfolio

								Power Dissipation
Product		VCC Range (V)			Speed		Operating ICC (mA)
					(ns)					Standby ISB2 (μA)
						f = 1 MHz		f = fmax
	Min		Typ[4]	Max		Typ[4]	Max	Typ[4]	Max	Typ[4]	Max
CY62167EV18LL	1.65		1.8	2.25	55	2.2	4.0	25	30	1.5	12
CY62167EV30LL[5]

Notes

1.The information related to 6 x 7 x 1 mm VFBGA package is preliminary.

2.NC pins are not connected on the die.

3.Ball H6 for the VFBGA package can be used to upgrade to a 32M density.

4.Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C.

5.This part can be operated in the VCC range of 1.65V–2.25V at 55ns speed. It can also be operated in the VCC range of 2.2V–3.6V at 45ns speed.

Document #: 38-05447 Rev. *G Page 2 of 13

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