CY7C1365C
Document #: 38-05690 Rev. *E Page 17 of 18
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsib ility f or the u se
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
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Package Diagram
NOTE:
1.JEDEC STD REF MS-026
2.BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH
MOLDPROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE
3.DIMENSIONS IN MILLIMETERS
BODYLENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH
0.30±0.08
0.65
20.00±0.10
22.00±0.20
1.40±0.05
12°±1°
1.60MAX.
0.05MIN.
0.60±0.15
0°MIN.
0.25
0°-7°
(8X)
STAND-OFF
R0.08 MIN.
TYP.
0.20MAX.
0.15MAX.
0.20MAX.
R0.08 MIN.
0.20MAX.
14.00±0.10
16.00±0.20
0.10
SEEDETAIL A
DETAIL

A

1
100
30
31 50
51
80
81
GAUGEPLANE
1.00REF.
0.20MIN.
SEATINGPLANE

100-Pin TQFP (14 x 20 x 1.4 mm) (51-85050)

51-85050-*B
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