CY7C1470V33
CY7C1472V33
CY7C1474V33
Document #: 38-05289 Rev. *I Page 19 of 29
Capacitance[15]
Parameter Description Test Conditions 100 TQFP
Max. 165 FBGA
Max. 209 FBGA
Max. Unit
CADDRESS Address Input Capacitance TA = 25°C, f = 1 MHz,
VDD = 3.3V
VDDQ = 2.5V
6 6 6 pF
CDATA Data Input Capacitance 5 5 5 pF
CCTRL Control Input Capacitance 8 8 8 pF
CCLK Clock Input Capacitance 6 6 6 pF
CI/O Input/Output Capacitance 5 5 5 pF
Thermal Resistance[15]
Parameters Description Test Conditions 100 TQFP
Package 165 FBGA
Package 209 FBGA
Package Unit
ΘJA Thermal Resistance
(Junction to Ambient) Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
24.63 16.3 15.2 °C/W
ΘJC Thermal Resistance
(Junction to Case) 2.28 2.1 1.7 °C/W
AC Test Loads and Waveforms
Note:
15.Tested initially and after any design or process changes that may affect these parameters.
OUTPUT
R = 317Ω
R = 351Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
V
L
= 1.5V
3.3V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
3.3V I/O Test Load
OUTPUT
R = 1667Ω
R = 1538Ω
5pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
RL= 50Ω
Z0= 50Ω
VL= 1.25V
2.5V ALL INPUT PULSES
VDDQ
GND
90%
10% 90%
10%
≤1 ns ≤1 ns
(c)
2.5V I/O Test Load
[+] Feedback