CY7C1470V33
CY7C1472V33
CY7C1474V33
Document #: 38-05289 Rev. *I Page 28 of 29
Document History Page
Document Title: CY7C1470V33/CY7C1472V33/CY7C1474V33 72-Mbit (2M x 36/4M x 18/1M x 72)
Pipelined SRAM with NoBL™ Architecture
Document Number: 38-05289
REV. ECN No. Issue Date Orig. of
Change Description of Change
** 114676 08/06/02 PKS New Data Sheet
*A 121520 01/27/03 CJM Updated features for package offering
Removed 300-MHz offering
Changed tCO, tEOV, tCHZ, tEOHZ from 2.4 ns to 2.6 ns (250 MHz),
tDOH, tCLZ from 0.8 ns to 1.0 ns (250 MHz), tDOH, tCLZ from 1.0 ns
to 1.3 ns (200 MHz)
Updated ordering information
Changed Advanced Information to Preliminary
*B 223721 See ECN NJY Changed timing diagrams
Changed logic block diagrams
Modified Functional Description
Modified “Functional Overview” section
Added boundary scan order for all packages
Included thermal numbers and capacitance values for all packages
Included IDD and ISB values
Removed 250-MHz offering and included 225-MHz speed bin
Changed package outline for 165FBGA package and 209-ball BGA package
Removed 119-BGA package offering
*C 235012 See ECN RYQ Minor Change: The data sheets do not match on the spec system and
external web
*D 243572 See ECN NJY Chan ged ball C11,D11,E11,F11,G11 from DQPb,DQb,DQb,DQb,DQb to
DQPa,DQa,DQa,DQa,DQa in page 4
Modified capacitance values in page 20
*E 299511 See ECN SYT
VBL
Removed 225-MHz offering and included 250-MHz speed bin
Changed tCYC from 4.4 ns to 4.0 ns for 250-MHz Speed Bin
Changed ΘJA from 16.8 to 24.63 °C/W and ΘJC from 3.3 to 2.28 °C/W for
100 TQFP Package on Page # 20
Added lead-free information for 100-Pin TQFP and 165 FBGA Packages
Added comment of ‘Lead-free BG packages availability’ below the Ordering
Information
Add Industrial part numbers in Ordering Info section
*F 323039 See ECN PCI Unshaded 250 MHz speed bin in the AC/DC Table and Selection Guide
Address expansion pins/balls in the pinouts for all packages are modified as
per JEDEC standard
Added Address Expansion pins in the Pin Definitions Table
Modified VOL, VOH Test Conditions
Changed package name from 209-ball PBGA to 209-ball FBGA on page# 5
Removed comment of ‘Lead-free BG packages availability below the
Ordering Information
Updated Ordering Information Table
Changed from Preliminary to Final
*G 351937 See ECN PCI Updated Ordering Information Table
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