SED1520 Series
PAD
Pad Arrangement
Chip specifications of AL pad package | Chip specifications of gold bump package | ||
Chip size: | 4.80×7.04×0.400 mm | Chip size: | 4.80×7.04×0.525 mm |
Pad pitch: | 100×100 μm | Bump pitch: | 199 μm (Min.) |
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| Bump height: | 22.5 μm (Typ.) |
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| Bump size: | 132×111 μm (±20 μm) for mushroom |
model
116×92 μm (±4 μm) for vertical model
100 | 95 | 90 |
| 85 | |
1 |
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| 80 |
5 |
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| 75 |
10 |
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| 70 | ||
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15 |
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| (0, 0) | 65 | |||
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20 |
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| 60 |
25 |
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AA * |
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| 55 |
D1520D |
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30 | 35 | 40 | 45 | 50 | |
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| 4.80 mm |
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7.04 mm
Note: An example of SED1520DAA die numbers is given. These numbers are the same as the bump package.
EPSON |