CHAPTER 5 Installation
5.1Notes on Handling Drives
5.2Setting
5.3Mounting Drives
5.4Dismounting Drives
5.5Checking Operation after Installation and Preparing the IDD for Use
5.6Spare Disk Drive
This chapter describes the notes on handling drives, setting, mounting drives, confirming drive operations after installation and preparation for use, and dismounting drives.
5.1Notes on Handling Drives
The items listed in the specifications in Table 2.1 must be strictly observed.
(1)General notes
a)Do not give the drive shocks or vibrations exceeding the value defined in the standard because it may cause critical damage to the drive. Especially be careful when unpacking.
b)Do not leave the drive in a dirty or contaminated environment.
c)Since static discharge may destroy the CMOS semiconductors in the drive, note the following after unpacking:
•Use an antistatic mat and body grounding when handling the drive.
•Hold the DE when handling the drive. Do not touch PCAs except for setting.
Hot temperature
To prevent injury, do not handle the drive until after the device has cooled sufficiently after turning off the power. The DE and LSI become hot during operation and remain hot immediately after turning off the power.
