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5 HARDWARE DESCRIPTION
5.1 Mechanical Design
The MARK III is a modular design that consists of a number of circuit card assemblies (CCAs) which are enclosed in a lightweight aluminum chassis. The internal interconnect between circuit card assemblies consists of a combination of highly reliable
The MARK III is designed so that it may be repaired and
PROCESSOR CCA
INPUT/OUTPUT CCA
POWER SUPPLY
GROWTH CCA #1
GROWTH CCA #2
ARINC 600
INTERCONNECT CCA
Figure 31 MARK III Top View
5.1.1 Interconnect CCA
The A1 Interconnect circuit card assembly provides interconnect between connector, the Processor CCA, Power Supply CCA and Input/Output CCA. features:
the unit's rear ARINC 600 The CCA has the following
Signals are routed in a
The circuit card assembly contains lightning suppression circuitry that meets the latest requirements of DO- 160D. ARINC 600 connector pins are replaceable on an individual pin basis (front removable).
The interconnection of
HONEYWELL Aerospace Electronic Systems | Page 47 |
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