Remove the heat sink:

1.Loosen the four captive Phillips PM2.5×10.0 screws (1) that secure the heat sink to the system board.

NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side

to detach it.

2.Lift the left side (2) of the heat sink until it disengages from the system board.

3.Rotate the heat sink (3) counterclockwise until it is clear of the rear right corner of the base enclosure.

4.Remove the heat sink.

The thermal material must be thoroughly cleaned from the surfaces of the heat sink and

the system board components each time the heat sink is removed. Replacement thermal material is included with the heat sink, processor, and system board spare part kits. Thermal paste is used on the processor (1) and the heat sink section (2) that services it.

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Chapter 4 Removal and replacement procedures