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HP 8000 tower manual Audio Specifications, HD Audio Subsystem Specifications

Models: 8000 tower

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Input/Output Interfaces

5.7.4 Audio Specifications

The specifications for the HD Audio subsystem are listed in Table 5-9.

Table 5-9.
HD Audio Subsystem Specifications

Parameter	Measurement

Sampling Rates:
DAC	44.1-, 48-, 96-, & 192-KHz
ADC	44.1-, 48-, 96-, & 192KHz

Resolution:
DAC	24-bit
ADC	24-bit

Nominal Input Voltage:
Mic In (w/+20 db gain)	.283 Vp-p
Line In	2.83 Vp-p

Subsystem Impedance:
Mic In	20K ohms
Line In	20K ohms
Line Out (minimum expected load)	10K ohms
Headphones Out (minimum expected load)	32 ohms

Signal-to-Noise Ratio
Line out	90 db (nom)
Headphone out	90 db (nom)
Microphone / line in	85 db (nom)

Total Harmonic Distortion (THD)
Line out	-84 db
Headphone out	-80 db
Microphone / line in	-78 db

Max. Subsystem Power Output to 4-ohm Internal	1.5 watts
Speaker (with 10% THD):

Gain Step	1.5 db

Master Volume Range	-58.5 db

Frequency Response:
ADC/DAC	20– 20000 Hz
Internal Speaker	450–20000 Hz

Technical Reference Guide

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HP 8000 tower manual Audio Specifications, The specifications for the HD Audio subsystem are listed in Table

Contents

December Technical Reference GuideHP Compaq 8000 Elite Series Business Desktop Computers Document Part NumberTechnical Reference Guide HP Compaq 8000 Elite Series Business Desktop ComputersFirst Edition December Document Part Number Contents 1 Introduction2 System Overview 3 Processor/Memory Subsystem 4 System Support5 Input/Output Interfaces 6 Integrated Graphics Subsystem 7 Power and Signal DistributionA Error Messages and Codes Index 8 SYSTEM BIOS1.1.1 Online Viewing Introduction1.1 About this Guide 1.2 Additional Information Sources1.4.2 Values 1.3 Serial Number1.4 Notational Conventions 1.4.1 Special NoticesAbbreviation 1.5 Common Acronyms and AbbreviationsAcronyms and Abbreviations Acronym orAbbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orAbbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orAbbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orAbbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orAbbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orAbbreviation Table 1-1 ContinuedAcronyms and Abbreviations Acronym orIntroduction 1-10Technical Reference Guide 2.1 Introduction System Overview2.2 Features USDT Feature Differences by Form FactorArchitectural Differences by Form Factor 2.3 System ArchitectureTechnical Reference Guide System Overview2.3.1 Intel Processor Support 2.3.2 ChipsetChipset Components and Functionality 2.3.3 Support Components 2.3.4 System MemorySupport Component Functions 2.3.8 Network Interface Controller 2.3.5 Mass Storage2.3.6 Serial Interface 2.3.7 Universal Serial Bus Interface2.3.9 Graphics Subsystem 2.3.10 Audio SubsystemIntegrated Graphics Subsystem Statistics 2.4 Specifications 2.3.11 HP ProtectTools Embedded SecurityEnvironmental Specifications Factory Configuration Physical Specifications Power Supply Electrical SpecificationsSystem Overview 2-12Technical Reference Guide 3.1 Introduction Processor/Memory Subsystem3.2.1 Intel Processor Overview 3.2 Intel ProcessorsSupported Processors partial listing 3.2.2 Processor Changing/Upgrading3.3 Memory Subsystem 3.3.1 Memory Upgrading 3.3.2 Memory Mapping and Pre-allocationMemory Socket Loading Figure 3-2. System Memory Map for maximum of 8 gigabytes Expansion AreaBase Memory 4.2.1 PCI 2.3 Bus Operation System Support4.1 Introduction 4.2 PCI Bus OverviewPCI Bus PCI Component Configuration AccessWired to System SupportPCI Bus Mastering Devices 4.2.2 PCI Express Bus OperationSoftware/Driver Layer Transaction Protocol LayerLink Layer 4.2.5 PCI Power Management Support4.2.3 Option ROM Mapping 4.2.4 PCI InterruptsFigure 4-2. 32-bit, 5.0-volt PCI 2.3 Bus Connector 4.2.6 PCI ConnectorsPCI 2.3 Connector PCI 2.3 Bus Connector PinoutPCIe Connectors PCIe Bus Connector PinoutFigure 4-3. PCIe Bus Connectors APIC Mode 4.3 System Resources4.3.1 Interrupts 8259 ModePCI Interrupt Distribution 4.3.2 Direct Memory Access4.4.1 Clearing CMOS 4.4 Real-Time Clock and Configuration MemoryConfiguration Memory CMOS Map 4.5 System Management4.4.2 Standard CMOS Locations 4.5.1 Security FunctionsI/O Interface Security Power-On / Setup PasswordSetup Password Cable Lock Provision4.5.2 Power Management Smart Cover Lock OptionalACPI Wake-Up Events 4.5.3 System Status 4.5.4 Thermal Sensing and CoolingSystem Operational Status LED Indications 4.6.1 System I/O Map 4.6 Register Map and Miscellaneous FunctionsSystem I/O Map I/O PortFunction 4.6.2 GPIO Functions ICH10 FunctionsSIO Controller Functions 5.1 Introduction Input/Output Interfaces5.2.1 SATA interface 5.2 SATA/eSATA Interfaces5.2.2 eSATA interface DB-9 Serial Connector Pinout 5.3 Serial Interface5.4 Parallel Interface Support 5.4.1 Standard Parallel Port Mode5.4.2 Enhanced Parallel Port Mode 5.4.3 Extended Capabilities Port Mode5.4.4 Parallel Interface Connector DB-25 Parallel Connector Pinoute w q - 9 8 7 6 5 4 3 2 1 g f d s a p o i u y t r 5.5.1 Keyboard Interface Operation 5.5 Keyboard/Pointing Device Interface5.5.3 Keyboard/Pointing Device Interface Connector 5.5.2 Pointing Device Interface OperationKeyboard/Pointing Device Connector Pinout 5.6 Universal Serial Bus Interface 5.6.1 USB ConnectorUSB Color Code 5.6.2 USB Cable DataUSB Connector Pinout USB Cable Length DataFigure 5-8. Audio Subsystem Functional Block Diagram 5.7 Audio Subsystem5.7.1 HD Audio Controller 5.7.2 HD Audio Link Bus5.7.3 Audio Multistreaming 5.7.4 Audio Specifications The specifications for the HD Audio subsystem are listed in TableHD Audio Subsystem Specifications 5.8 Network Interface Controller 5.8.3 Power Management Support 5.8.1 Wake-On-LAN Support5.8.2 Alert Standard Format Support 5.8.4 NIC Connector 5.8.5 NIC SpecificationsTable 5-11. NIC Specifications 6.1 Introduction Integrated Graphics Subsystem6.2 Functional Description SDRAM Installed GMA 4500 Memory AllocationMaximum Memory Allocation 6.3 Display Modes 6.4 Upgrading 6.5.1 Analog Monitor Connector 6.5 Monitor ConnectorsFigure 6-3. DisplayPort Connector, as viewed from rear of chassis 6.5.2 DisplayPort ConnectorTechnical Reference Guide Integrated Graphics SubsystemPower and Signal Distribution 7.2 USDT Power Distribution7.1 Introduction Figure 7-2. SFF/CMT Power Distribution and Cabling, Block Diagram 7.3 SFF/CMT Power DistributionTable 7-1 lists the specifications of the external supply USDT 135-Watt Power Supply Unit SpecificationsCMT 320-Watt Power Supply Unit Specifications SFF 240-Watt Power Supply Unit Specifications7.4.1 Power Button 7.4 Power ControlPre-video memory error. Incompatible or incorrectly seated Power LED IndicationsPower LED Power failure power supply is overloaded. Check storageWake-On-LAN 7.5 Power Management7.4.2 Wake Up Events Power Management EventState System Power StatesPower PowerComponent function 7.6 Signal DistributionSystem Board Connector, Indicator, and Switch Designations DesignatorFigure 7-3. System Board Header Pinouts System Board Connector, Indicator, and Switch DesignationsFigure 7-5 shows pinouts of headers used on the sytem boards Table 7-7. ContinuedPower and Signal Distribution 7-10Technical Reference Guide 8.1 Introduction System BIOS8.2 ROM Flashing 8.2.1 Upgrading8.2.2 Changeable Splash Screen 8.3.3 Memory Detection and Configuration 8.3 Boot Functions8.3.1 Boot Device Order 8.3.2 Network Boot F12 Support8.3.4 Boot Error Codes 8.4 Client Management Functions 8.4.2 Temperature Status 8.4.1 System ID and ROM TypeSystem ID Numbers SMBIOS Functions 8.5 SMBIOS8.7 Management Engine Functions 8.6 USB Legacy SupportError Messages and Codes A.2 Beep/Power LED CodesA.1 Introduction Error Messages and Codes A.3 Power-On Self Test POST Messages1796-SATA Cabling Error Power-On Self Test POST MessagesError Message 1794--Inaccessible device attached to SATA1801-Microcode Patch Error Error Messages and Codes A.4 System Error MessagesMessage A.5 Memory Error MessagesMemory Error Messages Table A-4Message A.6 Keyboard Error MessagesMemory Error Messages Table A-4. ContinuedInt. test, LpBk. test., and cntrl. register failed A.7 Printer Error MessagesA.8 Video Graphics Error Messages Int. test, LpBk. test., and data register failedA.9 Diskette Drive Error Messages Probable Cause A.10 Serial Interface Error MessagesTable A-9 Serial Interface Error Messages MessageProbable Cause A.11 Modem Communications Error MessagesTable A-10 Modem Communications Error Messages MessageA.12 System Status Error Messages Cntlr. failed to deallocate bad sectors A.13 Hard Drive Error Messagesxx = 00, Hard drive ID test xx = 01, Hard drive format test A.14 Hard Drive Error Messages Lightpen graphics test failed, no resp A.15 Video Graphics Error MessagesA.16 Audio Error Messages EGA Mono. graphics mode test failedA.18 Network Interface Error Messages A.17 DVD/CD-ROM Error MessagesProbable Cause A.19 SCSI Interface Error Messages 65xx-xx, 66xx-xxTechnical Reference Guide MessageA.20 Pointing Device Interface Error Messages 8601-xx Error Messages and Codes A-20Technical Reference Guide Numerics Index