Grounding requirements

The HP POD 20c structure and internal components are all bonded together. A common grounding electrode conductor connection point is provided on the utility-end cold aisle.

WARNING: To avoid the risk of personal injury or electric shock, the HP POD 20c must be properly grounded (earthed) in accordance with national, regional, and local regulations.

The following is a list of component requirements for grounding and bonding:

Grounding of the HP POD 20c must comply with the requirements of IEC 364 and any applicable national, regional, and local regulations.

Bonding of the piping systems and any exposed structural steel installed to support the HP POD 20c must be in accordance with IEC 364 and any applicable national, regional, and local regulations.

Grounding feature

Specification

 

 

Earthing (grounding)

The earthing (grounding) electrode conductor connection bus pad is located on the

electrode conductor

outside of the HP POD 20c on the hot aisle side of the utility end of the POD and

pad

below the transformer cabinet.

 

The earthing (grounding) pad must be connected to the grounding electrode system

 

or building steel in accordance with IEC 364 or equivalent regulation.

 

 

Grounding lugs

Grounding lugs cannot be attached to any painted surface.

 

Grounding lugs must be compression-type 2-hole lugs and UL listed specifically for

 

grounding.

 

 

Earthing (grounding)

The customer must provide an effective earthing (grounding) system with a ground rod

rod system or ground

or a ground well.

well

 

IMPORTANT: Before installing the HP POD 20c, consult your local Authorities for applicable regulations and to review site-specific location guidelines. If needed, obtain any necessary permits.

The following figure shows the earthing (grounding) electrode conductor connection that is located on the cold aisle of the HP POD 20c.

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HP Performance Optimized Data Center (POD) 20cp manual Grounding requirements