Intel 5100 manual Thermal Metrology, MCH Case Measurement, Supporting Test Equipment

Intel® 5100 MCH Chipset

Table 4 summarizes the thermal budget required to adequately cool the Intel® 5100 MCH Chipset in one configuration using a TDP of 25 W. Further calculations would need to be performed for different TDPs. Because the results are based on air data at sea level, a correction factor would be required to estimate the thermal performance at other altitudes.

Table 4.	Required Heatsink Thermal Performance (ΨCA)
	Device	ΨCA (°C/W) at TLA = 45 °C	ΨCA (°C/W) at TLA = 60 °C
	Intel® 5100 MCH Chipset @ 25 W	2.4	1.8

5.0Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH case temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH case temperatures. Section 5.2 contains information on running an application program that will emulate anticipated maximum thermal design power (Figure 6).

5.1MCH Case Measurement

The Intel® 5100 MCH Chipset cooling performance is determined by measuring the case temperature using a thermocouple. For case temperature measurements, the attached method outlined in this section is recommended for mounting a thermocouple.

Special care is required when measuring the case temperature (TC) to ensure an accurate temperature measurement. Thermocouples are often used to measure TC. When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient air, errors may be introduced in the measurements. The measurement errors can be caused by poor thermal contact between the thermocouple junction and the surface of the integrated heat spreader, heat loss by radiation, convection, by conduction through thermocouple leads, or by contact between the thermocouple cement and the heatsink base. To minimize these measurement errors, the approach outlined in the next section is recommended.

Note: The thermocouple attach example shown below is on a different package, but the method and groove dimensions are the same. The thermocouple bead needs to be centered on the IHS.

5.1.1Supporting Test Equipment

To apply the reference thermocouple attach procedure, it is recommended that you use the equipment (or equivalent) given in Table 5.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008	TDG
Order Number: 318676-003US	15