Intel® 5100 MCH Chipset

Table 4 summarizes the thermal budget required to adequately cool the Intel® 5100 MCH Chipset in one configuration using a TDP of 25 W. Further calculations would need to be performed for different TDPs. Because the results are based on air data at sea level, a correction factor would be required to estimate the thermal performance at other altitudes.

Table 4.

Required Heatsink Thermal Performance (ΨCA)

 

 

Device

ΨCA (°C/W) at TLA = 45 °C

ΨCA (°C/W) at TLA = 60 °C

 

 

 

 

 

Intel® 5100 MCH Chipset @ 25 W

2.4

1.8

5.0Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH case temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH case temperatures. Section 5.2 contains information on running an application program that will emulate anticipated maximum thermal design power (Figure 6).

5.1MCH Case Measurement

The Intel® 5100 MCH Chipset cooling performance is determined by measuring the case temperature using a thermocouple. For case temperature measurements, the attached method outlined in this section is recommended for mounting a thermocouple.

Special care is required when measuring the case temperature (TC) to ensure an accurate temperature measurement. Thermocouples are often used to measure TC. When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient air, errors may be introduced in the measurements. The measurement errors can be caused by poor thermal contact between the thermocouple junction and the surface of the integrated heat spreader, heat loss by radiation, convection, by conduction through thermocouple leads, or by contact between the thermocouple cement and the heatsink base. To minimize these measurement errors, the approach outlined in the next section is recommended.

Note: The thermocouple attach example shown below is on a different package, but the method and groove dimensions are the same. The thermocouple bead needs to be centered on the IHS.

5.1.1Supporting Test Equipment

To apply the reference thermocouple attach procedure, it is recommended that you use the equipment (or equivalent) given in Table 5.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008

TDG

Order Number: 318676-003US

15

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Intel 5100 Thermal Metrology, MCH Case Measurement, Supporting Test Equipment, Required Heatsink Thermal Performance Ψ CA
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5100 specifications

The Intel 5100, officially known as the Intel Core 2 Duo Processor T5100, is a notable entry in Intel's line of mobile processors, designed primarily for laptops and portable computing devices. Released in early 2007, it targets users seeking a balance between performance and energy efficiency.

At its core, the Intel 5100 features a dual-core architecture that allows it to handle multiple tasks simultaneously, significantly improving multitasking capabilities compared to single-core processors. Clocked at a speed of 1.6 GHz, it provides robust performance for everyday computing tasks such as web browsing, document editing, and casual gaming.

One of the key technologies integrated into the Intel 5100 is Intel's 64-bit architecture, which enables the processor to utilize more than 4GB of RAM, catering to modern computing needs. This feature is particularly beneficial for users running demanding applications or multitasking, as it provides increased processing power and efficiency.

The Intel 5100 also incorporates Intel's Enhanced Intel SpeedStep Technology, which optimizes power consumption by dynamically adjusting the processor's frequency and voltage based on workload. This not only extends battery life in portable devices but also helps in reducing heat output, promoting a cooler computing experience.

Another significant aspect of the Intel 5100 is its support for Intel Virtualization Technology (VT-x). This feature allows multiple operating systems to run concurrently on the same machine, making it an excellent choice for developers and IT professionals who require virtual environments for testing and development purposes.

The processor is built on a 65nm process technology, which contributes to its energy efficiency and thermal management. With a Thermal Design Power (TDP) of just 35 watts, it remains within a reasonable thermal envelope, suitable for laptop designs without requiring excessive cooling solutions.

In terms of connectivity, the Intel 5100 supports a range of communication technologies. It is commonly paired with Intel’s 965GM chipset, which enhances graphics capabilities through Intel GMA X3100 integrated graphics, offering decent performance for standard visual tasks.

Overall, the Intel 5100 represents a solid choice for users seeking a combination of performance, efficiency, and advanced features, making it a reliable processor option for laptops in the mid to late 2000s. With its dual-core capabilities, 64-bit support, and energy-efficient design, it paved the way for future developments in mobile computing technology.
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