Intel 5100 manual Thermal Specifications, Thermal Solution Requirements, Thermal Design Power TDP

Intel® 5100 MCH Chipset

Note: These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

Note: These specifications are based on limited testing for design characterization. Loading limits are for the package only.

3.0Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level to which the thermal solutions should be designed. TDP is not the maximum power that the chipset can dissipate.

FC-BGA packages have a poor heat transfer capability into the board and have a minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the Intel® 5100 MCH Chipset.

3.2Case Temperature

To ensure proper operation and reliability of the Intel® 5100 MCH Chipset, the case temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Section 5.0, “Thermal Metrology” on page 15 for guidelines on accurately measuring package case temperatures.

Table 3. Intel® 5100 Memory Controller Hub Chipset Thermal Specifications

Parameter	Value	Notes
Tcase_max	105 °C
Tcase_min	5 °C
TDPMax config	25.7 W	DP FSB 1333, 2 channel DDR2 667, 3 x8 PCI Express*
TDPTypical ATCA config	23.0 W	DP FSB 1067, 2 channel DDR2 533, 3 x8 PCI Express*
TDPTypical UP config	19.5 W	UP FSB 1067, 1 channel DDR2 533, 1 x8 PCI Express*

4.0Thermal Solution Requirements

4.1Characterizing the Thermal Solution Requirement

The idea of a “thermal characterization parameter” Ψ (the Greek letter Psi) is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (in other words, heating source, local ambient conditions, and so forth). The thermal characterization parameter is calculated using total package power; whereas, actual thermal resistance, θ (theta), is calculated using actual power dissipated between two points. Measuring actual power dissipated into the heatsink is difficult, because some of the power is dissipated through a heat transfer into the package and board.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG	July 2008
12	Order Number: 318676-003US