Intel 5100 manual CompactPCI* Reference Heatsink, Component Overview, Reliability Guidelines

Intel® 5100 MCH Chipset

Table 7.	Reliability Guidelines
Test1		Requirement	Pass/Fail Criteria2
Mechanical Shock		50 g, board level, 11 ms, three shocks/axis	Visual Check and Electrical Functional Test
Random Vibration		7.3 g, board level, 45 minutes/axis, 50 Hz to 2000 Hz	Visual Check and Electrical Functional Test
Temperature Life		85 °C, 2000 hours total, checkpoints at 168, 500, 1000,	Visual Check
		and 2000 hours
Thermal Cycling		-5 °C to +70 °C, 500 cycles	Visual Check
Humidity		85% relative humidity, 55 °C, 1000 hours	Visual Check

Notes:

1.It is recommended that the above tests be performed on a sample size of at least 12 assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

6.2CompactPCI* Reference Heatsink

Intel has also developed a reference thermal solution compatible with the CompactPCI* form factor. The reference solution was developed assuming a maximum ambient temperature of 67 °C with a minimum volumetric airflow rate of 10 CFM through each slot. Assuming these boundary conditions are met, the reference thermal solution meets the thermal specifications for Intel® 5100 Memory Controller Hub Chipset.

6.2.1Component Overview

The CompactPCI* reference heatsink is an extruded aluminum heatsink and does not share the same volumetric footprint as the AdvancedTCA* reference heatsink. Full mechanical drawings of the thermal solution assembly, full mechanical drawings, volumetric footprint, and the heatsink clip are provided in Appendix A. It uses the same spring clip retention and Honeywell* PCM45F Thermal Interface Material (TIM) as the AdvancedTCA* reference solution.

Figure 21 shows the isometric view of the CompactPCI* reference heatsink.

Figure 21. Isometric View of the CompactPCI* Reference Heatsink

Note: Refer to Appendix A for more detailed mechanical drawings of the heatsink.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008	TDG
Order Number: 318676-003US	29