Intel 5100 manual Heatsink Orientation, Extruded Heatsink Profiles, Mechanical Interface Material

Intel® 5100 MCH Chipset

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix A. Appendix B contains vendor information for each thermal solution component.

6.1.5Heatsink Orientation

Because this solution is based on a unidirectional heatsink, the mean airflow direction must be aligned with the direction of the heatsink fins.

Figure 20. Torsional Clip Heatsink Assembly

6.1.6Extruded Heatsink Profiles

The reference thermal solution uses an extruded heatsink for cooling the MCH. Appendix B lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. A full mechanical drawing of this heatsink is provided in Appendix A.

6.1.7Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

6.1.8Thermal Interface Material

A thermal interface material (TIM) provides improved conductivity between the IHS and heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.25 mm (0.010") thick, 25 mm x 25 mm (0.984" x 0.984") squared.

Note: Unflowed or “dry” Honeywell* PCM45F has a material thickness of 0.010". The flowed or “wet” Honeywell* PCM45F has a material thickness of ~0.003" after it reaches its phase change temperature.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008	TDG
Order Number: 318676-003US	27