Intel 5100 manual Curing Process, Applying Adhesive on Thermocouple Bead

Intel® 5100 MCH Chipset

Figure 14. Applying Adhesive on Thermocouple Bead

5.1.6Curing Process

1.Let the thermocouple attach sit in the open air for at least half an hour. Using any curing accelerator like the Locite* 7452 Tak Pak* accelerator for this step is not recommended. Rapid contraction of the adhesive during curing may weaken bead attach on the IHS.

2.Reconfirm electrical connectivity with the DMM before removing the micromanipulator. See Section 5.1.4, step 2., and Figure 13.

3.Remove the 3D arm needle by holding down the MCH unit and lifting the arm.

4.Remove the Kapton tape, and straighten the wire in the groove so that it is flat all the way to the end of the groove (Figure 15).

5.Using a blade, shave excess adhesive above the IHS surface (Figure 16).

Note: Take usual precautions when using open blades.

6.Install new Kapton tape to hold the thermocouple wire down, and fill the rest of the groove with adhesive (Figure 17). Make sure the wire and insulation is entirely within the groove and below the IHS surface.

7.Curing time for the rest of the adhesive in the groove can be reduced using the Locite* 7452 Tak Pak* accelerator.

8.Repeat step 5. to remove any access adhesive to ensure a flat IHS for proper mechanical contact to the heatsink surface.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG	July 2008
22	Order Number: 318676-003US