Intel 5100 manual Heatsink Clip, Clip Retention Anchors, Reliability Guidelines

Intel® 5100 MCH Chipset

6.1.8.1Effect of Pressure on TIM Performance

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of heatsink. The effect of pressure on the thermal resistance of the Honeywell* PCM45F TIM is shown in Table 6.

Intel provides both End of Line and End of Life TIM thermal resistance values of Honeywell* PCM45F. End of Line and End of Life TIM thermal resistance values are obtained through measurement on a Test Vehicle similar to the Intel® 5000 Series Chipset’s physical attributes using an extruded aluminum heatsink. The End of Line value represents the TIM performance post heatsink assembly, while the End of Life value is the predicted TIM performance when the product and TIM reaches the end of its life. The heatsink clip provides enough pressure for the TIM to achieve an End of Line thermal resistance of 0.345 (°C × inches2)/W and End of Life thermal resistance of 0.459 (°C × inches2)/W.

Table 6. Honeywell* PCM45F TIM Performance as Function of Attach Pressure

	Thermal Resistance (°C × inches2)/W
Pressure (psi)
	End of Line	End of Life
2.18	0.319	0.551
4.35	0.345	0.459

6.1.9Heatsink Clip

The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten the clip to the board. See Appendix A for a mechanical drawing of the clip.

6.1.10Clip Retention Anchors

For Intel® 5100 MCH Chipset-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45 degree angle bent leads to increase the anchor attach reliability over time. See Appendix B for the part number and supplier information.

6.1.11Reliability Guidelines

Each motherboard, heatsink, and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 7.

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG	July 2008
28	Order Number: 318676-003US