Intel 5100 manual Definition of Terms, Term Definition

Intel® 5100 MCH Chipset

Figure 1. Thermal Design Process

Step 1: Thermal Simulation
•	Package Level Thermal Models
•	Thermal Model User’s Guide	Step 2: Heatsink Design
		and Selection
		•	Reference Heatsinks
		•	Reference Mounting Hardware	Step 3: Thermal Validation
		•	Vendor Contacts
				•	Thermal Testing Software
				•	Thermal Test Vehicle
				•	User Guides

1.2Definition of Terms

Table 1.	Definition of Terms
	Term	Definition
		Flip Chip Ball Grid Array. A package type defined by a plastic substrate where
		a die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
	FC-BGA	attach style. The primary electrical interface is an array of solder balls
		attached to the substrate opposite the die.
		Note: The device arrives at the customer with solder balls attached.
	BLT	Bond line thickness. Final settled thickness of the thermal interface material
		after installation of heatsink.
	ICH9	I/O Controller Hub 9
	IHS	Integrated Heat Spreader
		Memory controller hub. The chipset component that contains the processor
	MCH	interface, the memory interface, the PCI Express* interface and the ESI
		interface.
	Tcase_max	Maximum allowed component temperature. This temperature is measured at
		the geometric center of the top of the package IHS.
	Tcase_min	Minimum allowed component temperature. This temperature is measured at
		the geometric center of the top of the package IHS.
		Thermal design power. Thermal solutions should be designed to dissipate
	TDP	this target power level. TDP is not the maximum power that the chipset can
		dissipate.
	TIM	Thermal Interface Material
	ΨCA	Case-to-ambient thermal characterization parameter. A measure of the
		thermal solution thermal performance including TIM using the thermal
		design power. Defined as (TCASE - TLA) / TDP
	ΨCS	Case-to-sink thermal characterization parameter. A measure of the TIM
		thermal performance using the thermal design power. Defined as (TCASE -
		TLA) / TDP
	ΨSA	Sink-to-ambient thermal characterization parameter. A measure of heatsink
		thermal performance using the thermal design power. Defined as (TCASE -
		TLA) / TDP

Intel® 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008	TDG
Order Number: 318676-003US	7