Intel S5000XAL manual Server Board Design Specifications, 70Revision Intel order number D31979-007

Power and Environmental Specifications Intel® Server Board S5000PAL / S5000XAL TPS

8.Power and Environmental Specifications

8.1Intel® Server Board S5000PAL / S5000XAL Design Specifications

Operation of the server board at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect system reliability.

Table 34: Server Board Design Specifications

Operating Temperature	0º C to 55º C 1 (32º F to 131º F)
Non-Operating Temperature	-40º C to 70º C (-40º F to 158º F)
DC Voltage	± 5% of all nominal voltages
Shock (Unpackaged)	Trapezoidal, 50 g, 170 inches/sec
Shock (Packaged)
< 20 lbs	36 inches
≥ 20 to < 40	30 inches
≥ 40 to < 80	24 inches
≥ 80 to < 100	18 inches
≥100 to < 120	12 inches
≥120	9 inches

Vibration (Unpackaged)

5 Hz to 500 Hz 3.13 g RMS random

Note:

1Chassis design must provide proper airflow to avoid exceeding the Dual-Core Intel® Xeon® processor 5000 sequence maximum case temperature.

Disclaimer Note: Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.

70Revision 1.4

Intel order number: D31979-007