Functional Architecture

Intel® Server Board S5000PAL / S5000XAL TPS

Dual-Core Intel® Xeon® processors 5000 sequence will encompass the following:

Table 1. Processor Support Matrix

Processor Family

System Bus

Core

Cache

Watts

Support

 

Speed

Frequency

 

 

 

Intel® Xeon® processor

533 MHz

All

 

 

No

Intel® Xeon® processor

800 MHz

All

 

 

No

 

 

 

2x 2 MB

 

 

Dual-Core Intel® Xeon® processor 5030

667 MHz

2.67 GHz

95

Yes

Dual-Core Intel® Xeon® processor 5050

667 MHz

3.0 GHz

2x 2 MB

95

Yes

Dual-Core Intel® Xeon® processor 5060

1066 MHz

3.2 GHz

2x 2 MB

130

Yes

Dual-Core Intel® Xeon® processor 5063

1066 MHz

3.2 GHz

2x 2 MB

95

Yes

Dual-Core Intel® Xeon® processor 5080

1066 MHz

3.73 GHz

2x 2 MB

130

Yes

Dual-Core Intel® Xeon® processor 5110

1066 MHz

1.60 GHz

4MB shared

65

Yes

Dual-Core Intel® Xeon® processor 5120

1066 MHz

1.87 GHz

4MB shared

65

Yes

Dual-Core Intel® Xeon® processor 5130

1333 MHz

2 GHz

4MB shared

65

Yes

Dual-Core Intel® Xeon® processor 5140

1333 MHz

2.33 GHz

4MB shared

65

Yes

Dual-Core Intel® Xeon® processor 5150

1333 MHz

2.67 GHz

4MB shared

65

Yes

Dual-Core Intel® Xeon® processor 5160

1333 MHz

3 GHz

4MB shared

80

Yes

3.1.2.1Processor Population Rules

When two processors are installed, both must be of identical revision, core voltage, and bus/core speed. Mixed processor steppings is supported. However, the stepping of one processor cannot be greater than one stepping back of the other. When only one processor is installed, it must be in the socket labeled CPU1. The other socket must be empty.

The board is designed to provide up to 130A of current per processor. Processors with higher current requirements are not supported.

No terminator is required in the second processor socket when using a single processor configuration.

3.1.2.2Common Enabling Kit (CEK) Design Support

The server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and heat sink retention solution. The server board ships with a CEK spring snapped onto the underside of the server board, beneath each processor socket. The heat sink attaches to the CEK, over the top of the processor and the thermal interface material (TIM). See the figure below for the stacking order of the chassis, CEK spring, server board, TIM, and heat sink.

The CEK spring is removable, allowing for the use of non-Intel heat sink retention solutions.

Note: The processor heat sink and CEK spring shown in the following diagram are for reference purposes only. The actual processor heat sink and CEK solutions compatible with this generation server board may be of a different design.

26Revision 1.4

Intel order number: D31979-007

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Intel S5000XAL manual Processor Population Rules, Common Enabling Kit CEK Design Support, Processor Support Matrix